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Organic silicon material for power type LED encapsulation and synthetic method thereof

An LED packaging and silicone technology, applied in the fields of electronic chemicals and polymer science, can solve the problems of low transparency, low product hardness, affecting the service life, etc., and achieve high refractive index, high transparency, and excellent UV aging resistance. Effect

Inactive Publication Date: 2010-02-24
茂名市信翼化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (3) During the use of LEDs, light and heat often cause the aging of packaging materials, which seriously affects the service life of LEDs. Therefore, packaging materials must have good heat resistance and light aging behavior
But this patent can only produce elastic material products, no resin hard products, and the products made according to the above ratio are not high in hardness and low in transparency

Method used

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  • Organic silicon material for power type LED encapsulation and synthetic method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] The synthesis steps of vinyl-containing MQ silicone resin are as follows:

[0070] (1) Add 255.2 grams of trimethylchlorosilane, 38.6 grams of vinyldimethylethoxysilane, 500 grams of tetraethyl orthosilicate, 100 grams of butanol, 1000 grams of xylene and 0.5 gram of aluminum triisopropoxide, stirred evenly;

[0071] (2) Add 600 grams of distilled water dropwise when the temperature is 30°C, and the dropping time is controlled within 2 hours;

[0072] (3) After adding dropwise and reacting at 80°C for 4 hours, add 30 grams of vinyldimethylethoxysilane dropwise, add dropwise for 1 hour, and then react for 8 hours;

[0073] (4) Pour out the layers, take the resin and the solvent part and react at 80° C. for another 6 hours;

[0074] (5) After the reaction is finished, wash with water, filter, and remove unreacted matter and solvent to obtain vinyl-containing MQ silicone resin; the preparation steps of vinyl-terminated polysiloxane are as follows:

[0075] (1) Add 18.2 ...

Embodiment 2

[0081] The synthetic steps of vinyl silicone resin are as follows:

[0082] (1) Add 11.7 grams of trimethylchlorosilane, 22 grams of vinyldimethylethoxysilane, 35.6 grams of methyltriethoxysilane and 38 grams of vinyltriethoxysilane into a 3000ml four-necked flask , 253.8 grams of phenyltrichlorosilane, 83.2 grams of ethyl orthosilicate, 100 grams of isopropanol, 1000 grams of xylene and 0.7 gram of aluminum triisopropoxide, stirred evenly;

[0083] (2) Add 850 grams of distilled water dropwise when the temperature is 30°C, and the dropping time is controlled within 2 hours;

[0084] (3) After adding dropwise and reacting at 80°C for 2 hours, add 32 grams of vinyldimethylethoxysilane, 28.2 grams of methylvinyldichlorosilane, 168 grams of methylphenyldiethoxysilane, two The dropping time of 101.2 grams of phenyldichlorosilane is controlled within 2 hours;

[0085] (4) After 4 hours of reaction after the dropwise addition, 30 grams of vinyldimethylethoxysilane and 10 grams of ...

Embodiment 3

[0097] The synthesis steps of methylphenylvinylsiloxane are as follows:

[0098] (1) Add 35.3 grams of methyl vinyl dichlorosilane, 51.6 grams of dimethyl dichlorosilane, D 4 100 grams, 100 grams of octaphenylcyclotetrasiloxane, 315 grams of methylphenyldiethoxysilane, 379.5 grams of diphenyldichlorosilane, 800 grams of xylene and 1 gram of zinc benzoate, stir well;

[0099] (2) drip 80 grams of distilled water;

[0100] (3) Slowly raise the temperature to 90-110°C for reaction, react for 3 hours, observe the viscosity change, add 15 grams of vinyldimethylethoxysilane dropwise, and react for another 6 hours;

[0101](4) After the reaction is finished, wash with water, filter, and remove unreacted substances and solvents to obtain methylphenyl vinyl siloxane;

[0102] The synthesis steps of methylphenylhydrogensiloxane are as follows:

[0103] (1) Add 40.3 grams of methylhydrogen dichlorosilane, 64.5 grams of dimethyl dichlorosilane, D 4 100 grams, 100 grams of octaphenylcy...

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Abstract

The invention discloses an organic silicon material for power type LED encapsulation and a synthetic method thereof. The organic silicon material consists of vinyl silicone high polymer, curing catalyst, high polymer containing hydrogen-based silicon and inhibitor, wherein the vinyl silicone high polymer is composed of vinyl silicone resin and polysiloxane containing vinyl or is only composed of the polysiloxane containing vinyl or only composed of the vinyl silicone resin; the polysiloxane containing vinyl is vinyl-terminated polysiloxane; and the high polymer containing hydrogen-based silicon is composed of poly cyano-group siloxane and the vinyl silicone resin or is only composed of poly cyano-group siloxane. The organic silicon material has the advantages of higher refractive index, high transparency, good ultraviolet ageing resistant property, thermal ageing capacity and the like, and is an ideal encapsulation material for power type LED.

Description

Technical field: [0001] The invention relates to the technical fields of electronic chemicals and polymers, in particular to an organosilicon material for power LED packaging and a synthesis method thereof. Background technique: [0002] In recent years, LED technology and market at home and abroad have developed rapidly. Among them, the luminous efficiency of LED has increased by 100 times, and the cost has dropped by 10 times. The development prospects of backlight, automobile combination taillights and interior lighting, etc., have attracted global lighting manufacturers to join in LED light source and market development. Therefore, LED is known as a new light source in the 21st century, and is expected to become the fourth-generation light source after incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps. [0003] Semiconductor LEDs are used as lighting sources, and the luminous flux of conventional products is far from that of general-purpose l...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08G77/06H01L33/00
Inventor 柯松
Owner 茂名市信翼化工有限公司
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