Curable resin composition, led package, and method for production of the led package, and optical semiconductor

A curable resin and composition technology, applied in semiconductor devices, electrical solid devices, electrical components, etc., can solve the problems of difficulty in controlling the thickness of the sealing resin, slow curing of the thermosetting resin, and easy mixing of the sealing resin into the voids. High performance, improved life or reliability, and superior optical or mechanical properties

Inactive Publication Date: 2010-03-10
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, there is a problem that the curing of the thermosetting resin is slow and the productivity is poor.
In addition, it is difficult to control the thickness of the sealing resin, or it is easy to mix voids in the sealing resin

Method used

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  • Curable resin composition, led package, and method for production of the led package, and optical semiconductor
  • Curable resin composition, led package, and method for production of the led package, and optical semiconductor
  • Curable resin composition, led package, and method for production of the led package, and optical semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0150] As a polyol component, 28.3 parts by mass of polycaprolactone triol A1 (manufactured by Daisy Road Chemical Industry Co., Ltd., trade name "Plaxil 303") having a weight average molecular weight of 300 and a hydroxyl value of 540 mgKOH / g and Weight-average molecular weight: 500 and hydroxyl value: 230 mgKOH / g polycarbonate diol A2 (manufactured by Daishiro Chemical Industry Co., Ltd., trade name "Prachill CD205PL") 28.3 parts by mass, and as a polyisocyanate component, isocyanate 43.3 parts by mass of phorone diisocyanate B1 (manufactured by Digesa Japan Co., trade name "IPDI") and [2-{3-(3-tert-butyl-4-hydroxyl-5) as a hindered phenolic antioxidant -methylphenyl)propionyl}-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane C1 (manufactured by Sumitomo Chemical Co., trade name "Smilite GA-80") 0.1 parts by mass, the mixture mixed as above was uniformly dispersed and dissolved by ultrasonic dispersion, and degassed under reduced pressure to obtain solution S1 of a cur...

Embodiment 2

[0154] 35.0 parts by mass of the above-mentioned polycaprolactone triol A1 as a polyol component, 7.0 parts by mass of the above-mentioned polycarbonate diol A2, and 28.7 parts by mass of 4,4'-methylenebis( Cyclohexyl isocyanate) B2 (manufactured by Digesa Japan Co., trade name "H 12 MDI"), 29.4 parts by mass of isocyanate-type triisocyanate B3 (manufactured by Asahi Kasei Chemicals Co., Ltd., trade name "Dulite THA-100"), and 0.1 parts by mass of the above-mentioned [2- {3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyl}-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5 , 5] Undecane C1, the mixture mixed as above was uniformly dispersed and dissolved by ultrasonic dispersion, and then degassed under reduced pressure to obtain a solution S2 of a curable resin composition.

[0155] Next, except having used the solution S2 of this curable resin composition instead of solution S1 of curable resin composition, it carried out similarly to Example 1, and completed the LED package.

Embodiment 3

[0157] 40.9 parts by mass of the above-mentioned polycaprolactone triol A1 as a polyol component, 4.5 parts by mass of trimethylolpropane A3 (manufactured by Perstorp), and 25.8 parts by mass of the above-mentioned 4,4'-ethylene oxide as a polyisocyanate component were mixed. Methyl bis(cyclohexyl isocyanate) B2, 29.7 parts by mass of 1,3-bis(isocyanate methyl)cyclohexane B4 (manufactured by Mitsui Chemicals Polyurethane Co., Ltd., trade name "Tacnut T600"), and 0.1 parts by mass The above-mentioned [2-{3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyl}-1,1-dimethylethyl]-2 as a hindered phenolic antioxidant , 4,8,10-tetraoxaspiro[5,5]undecane C1, the mixture mixed as above was uniformly dispersed and dissolved by ultrasonic dispersion, and then degassed under reduced pressure to obtain a curable resin Composition of solution S3.

[0158] Next, except having used the solution S3 of this curable resin composition instead of solution S1 of curable resin composition, it carried...

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Abstract

The curable resin composition of the present invention comprises a polyol component containing tri- or higher functional polycaprolactone polyol; and a polyisocyanate component containing bifunctional or trifunctional alicyclic isocyanate having one or more chemical structures in which an isocyanate group is bonded to a secondary carbon atom.

Description

technical field [0001] The present invention relates to a curable resin composition, a light emitting diode (Light Emitting Diode; LED) package and a manufacturing method thereof. In addition, the present invention relates to a curable resin composition whose cured product has high optical transparency and is excellent in optical properties such as heat resistance and coloring resistance or mechanical properties, and a light-emitting diode (LED) using the cured product and which is excellent in reliability. , phototransistors, photodiodes, solid-state imaging elements and other optical semiconductors. Background technique [0002] Conventionally, acrylic resins excellent in transparency and light resistance have generally been used as resins for optical components. In addition, resins for optical components used in the field of optoelectronic devices are required to have heat resistance and mechanical properties in the mounting process of electronic substrates and the like ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/42C08G18/10B29C45/02B29C45/14C08K5/13C08L75/04H01L33/00B29K101/10H01L33/56
CPCC08G18/755C08G18/8025C08K5/13H01L33/56C08G18/4277C08G18/758C08G18/725C08G18/6644C08G18/4202C08G18/44H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/45144C08L75/04H01L2924/00014H01L2924/00H01L2924/00012C08G18/42C08G18/10H10K50/00
Inventor 富山健男田中祥子吉田明弘小林真悟
Owner RESONAC CORPORATION
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