Measurement method of thickness of subsurface damaged layer of bucky optical material
A technology of subsurface damage and optical materials, applied in the direction of measuring devices, using optical devices, and material analysis using radiation diffraction, etc., can solve problems such as unexplained measurements, unintuitive image processing results, and practical applications that are not suitable for engineering. Achieve strong engineering applicability and high precision
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0031] Example 1
[0032] figure 2 , image 3 A processing example of a flat sample of optical glass is shown. Measurement of subsurface damage layer thickness of a K9 optical glass flat sample: in image 3 Step1: Perform sub-surface damage detection on the optical surface after grinding with W20 abrasive grains for 20 minutes: such as image 3 As shown in Step 2, a tiny slope with an inclination angle of θ=6' is processed by the magnetorheological polishing process ( figure 2 ), along the direction of magnetorheological polishing indicated by the arrow, the profile information at different depths from the original plane can be reflected on the inclined plane. The inclined surface after magnetorheological polishing is treated with HF acid etching agent to clean the surface and further expose and enlarge the cracks on the inclined surface. Use the roughness profiler to scan from the dashed line near the start boundary of the slope ( figure 2 , image 3 Step3), feed al...
Example Embodiment
[0034] Example 2
[0035] like Image 6 A specific measurement example of the thickness of the subsurface damage layer of an optical ceramic spherical mirror is shown in Image 6 In Step 1, the optical surface after 20min grinding with W40 abrasive grains is subjected to sub-surface damage detection: such as Image 6 As shown in Step 2: Using the magnetorheological polishing process, a detection circular plane is thrown on a spherical sample with a radius of curvature R, and its horizontal radius is r. The cutting plane and the original spherical surface form a spherical crown ( Image 6 Step2), the circumference of the plane is shallow from the original surface, and the center of the circle is deep from the original surface. The cutting plane is treated with corrosive chemical reagents to amplify the exposure of subsurface cracks on the cutting plane; Image 6 In Step3 and Step4: use the white light interferometer to scan the point P at the circumference of the cut-out ci...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap