Measurement method of thickness of subsurface damaged layer of bucky optical material

A technology of subsurface damage and optical materials, applied in the direction of measurement devices, optical devices, and material analysis using radiation diffraction, etc., can solve problems such as unexplained measurement, unintuitive image processing results, and complicated use and debugging of optical microscopes. Achieve the effect of high precision and strong engineering applicability

Inactive Publication Date: 2011-02-09
XI AN JIAOTONG UNIV
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Problems solved by technology

Since this method needs to use an optical microscope to observe the inclined surface of magnetorheological polishing, it is complicated to use and debug the optical microscope, and there is a certain size limit on the size of the measured workpiece. The image processing result of this method is not intuitive and is not suitable for engineering practical application of
And the measurement of spherical and aspheric samples has not yet been explained

Method used

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  • Measurement method of thickness of subsurface damaged layer of bucky optical material
  • Measurement method of thickness of subsurface damaged layer of bucky optical material
  • Measurement method of thickness of subsurface damaged layer of bucky optical material

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Embodiment 1

[0032] figure 2 , image 3 A processing example of an optical glass flat sample is shown. Measurement of the subsurface damage layer thickness of a K9 optical glass flat sample: in image 3 Step1 Subsurface damage detection is performed on the optical surface after W20 abrasive grinding for 20 minutes: image 3 As shown in Step2, the magneto-rheological polishing process is used to process a tiny slope with an inclination angle of θ=6' ( figure 2 ), along the direction of magnetorheological polishing indicated by the arrow, the profile information at different depths from the original plane can be reflected on the slope. Use HF acid corrosion reagent to treat the slope after magnetorheological polishing, clean the surface and further expose and enlarge the cracks on the slope. Use the roughness profiler to scan from the dotted line near the start boundary of the slope ( figure 2 , image 3 Step3), feed along the slope along the direction of the arrow according to the ...

Embodiment 2

[0035] Such as Figure 6 As shown, a specific measurement example of the thickness of the subsurface damage layer of an optical ceramic spherical mirror, in Figure 6 Subsurface damage detection is performed on the optical surface after W40 abrasive grinding for 20 minutes in Step 1: Figure 6 Shown in Step 2: using the magnetorheological polishing process to throw a detection circular plane on a spherical sample with a radius of curvature R, and its horizontal radius is r. The cutting plane and the original spherical surface form a spherical cap ( Figure 6 Step2), the circumference of the plane is shallower than the original surface, and the center of the circle is deeper than the original surface. Use corrosive chemical reagents to treat the cut plane to enlarge the exposure of subsurface cracks on the cut plane; Figure 6 In Step3 and Step4: Use the white light interferometer to scan the circular plane from the circumference of the point P 1 (X 1 , Y 1 ,Z 1 ) along ...

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Abstract

The invention discloses a measurement method of the thickness of a subsurface damaged layer of a bucky optical material. The measurement method comprises the following steps: processing the surface of a sample by a magneto rheological process to form a specific cutting plane; cutting the subsurface damaged layer and reflecting a subsurface damage to the cutting plane; processing the cutting planewith a corrosive chemical agent to expose and amplify subsurface cracks on the cutting plane; measuring roughness values of different positions on the cutting plane by a roughness measurement tool toobtain a roughness value change curve; working out a height difference between a critical point or a climax and a starting point recorded in measurement process, or a height difference between two points projected on an original surface, i.e. the thickness d of the subsurface damaged layer of the sample, wherein the critical point or climax to level off is obtained from a roughness curve by the data processing. The measurement method can quickly and accurately measure optical samples of multiple surface shapes and multiple materials and can realize heavy-calibre and engineered application.

Description

technical field [0001] The invention relates to a method for measuring the thickness of a subsurface damaged layer of a hard and brittle optical material, which is used for measuring various optical elements ranging from plane to spherical and aspherical surfaces. The method can amplify the subsurface damage of hard and brittle optical materials, and can realize the measurement of the thickness of the tiny subsurface damage layer caused by ultra-precision grinding. Background technique [0002] At present, the existing method for measuring subsurface damage of hard and brittle optical materials is more accurate with magnetorheological polishing technology combined with optical microscope observation of inclined surfaces, such as: literature Suratwala T I, Wong L L, Miller P E et al., Sub-surface mechanical damage distribution during Grinding of fused silica [J]. Journal of Non-Crystalline Solids, 2006, 352: 5601-5617. The measurement material is a commonly used flat optical...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06G01B11/30G01N23/20G01N1/32
Inventor 王海容陈灿任军强孙国良苑国英蒋庄德
Owner XI AN JIAOTONG UNIV
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