Metallographical corrosive, method for eroding copper and method for displaying metallographical organization of copper

Abstract

The invention relates to a metallographical corrosive, a method for eroding copper and a method for displaying a metallographical organization of the copper. The method for displaying the metallographical organization of the copper comprises the following steps of: providing a copper sample; grinding the copper sample; polishing the ground copper sample; and immersing the polished copper sample into the metallographical corrosive, wherein the metallographical corrosive is a mixed solution of water, oxydol and ammonia. The metallographical corrosive prepared from the water, the oxydol and the ammonia has a favorable erosion effect to copper or copper alloy and can ensure that the display effect of the crystal boundary of the metallographical organization of the copper or the copper alloy, especially high-purity copper, is favorable.

Description

technical field [0001] The invention relates to a metallographic etchant, a copper etching method and a display method of the metallographic structure. Background technique [0002] The internal structure of metal materials is directly and closely related to material properties such as hardness, strength, and ductility, and metallographic observation is the most direct and effective method for studying the internal structure of metal materials. Metallography refers to the chemical composition of metals or alloys and the physical and chemical states of various components inside the metal or alloy. [0003] Metallographic observation is mainly to immerse the metal sample in a metallographic etchant to display the grain boundaries of the metal, and then use a metallographic microscope to observe the metallographic structure of the metal. The grain boundary is the interface between crystals with the same structure but different orientations, that is, the contact surface between...

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Problems solved by technology

[0004] Existing metallographic etchant for copper (Cu) and copper alloy generally adopts strong salt solution, for example, mixed solution containing high concentration nitric acid, ferric chloride hydrochloric acid solution, this kind of etchant is used in the research of lower purity copper, such as 4N (purity is 99.99%) copper and copper alloy metallographic structure, the effect is obvious, but for high-purity copper, such as 5N (purity is 99.999%) copper, 6N (purity is 99.9999%) copper, especially the metallographic structure of 6NCu However, the display effect of the grain boundary is unsatisfactory, and there are disadvantages such as high oxidation, high corrosion, volatile, and high risk to the safety of operators.

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