Positive type photosensitive resin composition

一种光敏树脂、组合物的技术，应用在光学、光机械设备、仪器等方向，能够解决损害已固化薄膜机械性能、增大抑制层、材料不能被充分地显影等问题

Active Publication Date: 2010-06-09
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the positive photosensitive polyimide precursor composition has a problem that a desired pattern cannot be obtained because the carbonic acid of the polyamic acid used is excessively highly soluble in alkali.
[0005] To solve this problem, a material has been proposed in which a phenolic hydroxy acid is introduced instead of carbonic acid by esterifying polyamidic acid with an alcohol compound having at least one hydroxyl group (see Japanese Patent Laid-Open No. H10-30739), but this material cannot be developed sufficiently, which leads to the following problems: layer reduction or resin delamination from the base (substrate)
However, the effect of suppressing the reduction of the unexposed portion is insufficient, so studies are required to increase the effect of suppressing the reduction of the layer and to prevent the generation of development residue (waste)
In addition, phenols are added to adjust the solubility, but they cause the problem that they are decomposed or have side reactions at high temperature during thermal curing, as a result of which the mechanical properties of the cured film are seriously impaired
[0009] However, the above studies can improve mechanical properties, especially elongation, but cannot achieve optical properties such as sensitivity, resolution, etc.

Method used

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  • Positive type photosensitive resin composition
  • Positive type photosensitive resin composition
  • Positive type photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0275] Synthesis Example 1: Synthesis of Polybenzoxazole Precursor (PBO-A)

[0276] In a four-necked flask equipped with a stirrer, a temperature control device, a nitrogen injector, and a condenser, 17.4 g of 2,2-bis(3-amino-4-hydroxyphenyl)-1,1,1,3 , 3,3-hexafluoropropane and 0.86 g of 1,3-bis(aminopropoxy)dimethylsiloxane were dissolved in 280 g of N-methyl-2-pyrrolidone (NMP) while nitrogen was in it pass. The above solution contained 9% by weight solids.

[0277] When the solid was completely dissolved, 9.9 g of pyridine was added to the solution. On the other hand, 13.3 g of 4,4'-oxydibenzoyl chloride was dissolved in 142 g of N-methyl-2-pyrrolidone (NMP). This solution was slowly added dropwise over 30 minutes while maintaining the former solution at a temperature of 0 to 5°C. Next, a reaction was performed at a temperature of 0 to 5° C. for 1 hour, and then the obtained solution was heated to room temperature and stirred for one hour.

[0278]Then, 1.6 g of 5-no...

Embodiment 2

[0281] Synthesis Example 2: Polybenzoxazole precursor (PBO-B 1 )Synthesis

[0282] In a four-necked flask equipped with a stirrer, a temperature control device, a nitrogen injector, and a condenser, 10.1 g of 2,2-bis(3-amino-4-hydroxyphenyl)-1,1,1,3 , 3,3-hexafluoropropane was dissolved in 111.1 g of N-methyl-2-pyrrolidone (NMP) while passing nitrogen gas therethrough. The solution contained 9 wt% solids.

[0283] To completely dissolve the solid, 4.2 g of pyridine was added to the solution. The obtained mixture was kept at a temperature of 0 to 5°C. On the other hand, 5.78 g of trans-3,6-endomethylene-1,2,3,6-tetrahydrophthaloyl chloride was dissolved in 100 g of N-methyl-2-pyrrolidone (NMP) . This solution was slowly added to the former solution in a dropwise manner over 30 minutes. The mixed solution was reacted at a temperature of 0 to 5° C. for 1 hour, then heated to room temperature and reacted for one hour.

[0284] Next, 1.2 g of 5-norbornene-2,3-dicarboxy...

Embodiment 3

[0288] Polybenzoxazole precursor (PBO-B 2 )Synthesis

[0289] In a four-necked flask equipped with a stirrer, a temperature control device, a nitrogen injector, and a condenser, 10.1 g of 2,2-bis(3-amino-4-hydroxyphenyl)-1,1,1,3 , 3,3-hexafluoropropane was dissolved in 111.1 g of N-methyl-2-pyrrolidone (NMP), while nitrogen gas was passed therethrough. The solution contained 9 wt% solids.

[0290] When the solid was completely dissolved, 4.2 g of pyridine was added to the solution. The resulting mixture was maintained at a temperature of 0 to 5°C. By dissolving 2.89g of trans-3,6-endomethylene-1,2,3,6-tetrahydrophthaloyl chloride and 3.9g of 4,4'-oxydibenzoyl chloride in 100g Another solution was prepared in N-methyl-2-pyrrolidone (NMP). This solution was added to the former solution in a dropwise manner over 30 minutes. The mixed solution was reacted at a temperature of 0 to 5° C. for 1 hour, then heated to room temperature and reacted for 1 hour.

[0291] Next, ...

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Abstract

Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent.

Description

technical field [0001] The invention relates to a positive photosensitive resin composition. More specifically, the present invention relates to a positive photosensitive resin composition having high sensitivity and separation (resolution), good pattern forming ability, low film shrinkage, high residue removal power, and Excellent mechanical properties. Background technique [0002] Conventional surface protective layers and interlayer insulating layers used in semiconductor devices include polyimide resins, which have excellent heat resistance and electrical characteristics, mechanical characteristics, and the like. [0003] Polyimide resins have recently been used as a form of photosensitive polyimide precursor composition, and by coating the polyimide precursor composition on a semiconductor device, patterning with the aid of ultraviolet (UV) rays oxidization, development, and thermal imidization thereof, it can be coated and form a surface protection layer, an interla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075
CPCG03F7/0233G03F7/0048Y10S430/107G03F7/039G03F7/075
Inventor 郑斗瑛郑知英赵显龙俞龙植郑闵鞠李种和李吉成车明焕
Owner CHEIL IND INC
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