Light intensity distribution analogy method of heavy-rubber ultraviolet light oblique incidence back etching process
A technology of light intensity distribution and ultraviolet light, which is applied in the direction of microlithography exposure equipment, photolithography process exposure device, special data processing application, etc., can solve the problem that it is impossible to simulate the light intensity of SU-8 adhesive ultraviolet light oblique incident backside lithography process Distribution and other issues
Inactive Publication Date: 2010-07-14
SOUTHEAST UNIV
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[0005] Technical problem: The purpose of this invention is to provide a light intensity distribution simulation method for SU-8 glue ultraviolet light oblique incidence backside lithography process, to solve the problem that the current traditional light intensity distribution simulation method based on scalar diffraction theory cannot simulate SU-8 8 Problems of the light intensity distribution of the oblique incident back photolithography process of glue ultraviolet light
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[0025] On the basis of scalar diffraction theory, the invention adopts the paraxial approximation technology of oblique incidence of ultraviolet light to process and simplify the Fresnel-Kirchhoff diffraction integral equation. At the same time, the refraction and reflection of obliquely incident ultraviolet light from the back at the interface of air / reticle, reticle / SU-8 glue, and the attenuation of obliquely incident ultraviolet light from the back inside SU-8 glue were considered. It can quickly and accurately simulate the light intensity distribution inside the SU-8 glue during the oblique incident backside photolithography process of SU-8 glue ultraviolet light. The basic steps of this method are as follows:
[0026] (1) According to the photolithography process conditions and parameters, input the left and right boundary coordinates of the mask hole (x 1 , x 2 ), the incident angle Φ of obliquely incident ultraviolet light in air from the back, and the wavelength λ of...
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The invention relates to a light intensity distribution analogy method of a heavy-rubber ultraviolet light oblique incidence back etching process, which aims to solve the problem that the traditional light intensity distribution analogy method based on a scalar diffraction theory can not simulate the light intensity distribution of an SU-8 rubber ultraviolet light oblique incidence back etching process currently. A method which meets the following two conditions can be regarded as the light intensity distribution analogy method of the SU-8 rubber ultraviolet light oblique incidence back etching process: a. a paraxial approximation technology with ultraviolet light oblique incidence is used to process a Fresnel-Kirchhoff diffraction integral equation based on the scalar diffraction theory and a light intensity computation model suitable to the SU-8 rubber ultraviolet light oblique incidence back etching process is put forward; and b. the light intensity computation model of back oblique incidence ultraviolet light comprehensively considers the reflection and refraction of the back oblique incidence ultraviolet light in air / mask plate, mask plate / SU-8 rubber interface, decay of the back oblique incidence ultraviolet light in SU-8 rubber and other factors, and precisely simulates the light intensity distribution of the SU-8 rubber ultraviolet light oblique incidence back etching process.
Description
technical field [0001] The invention provides a method for simulating light intensity distribution used in thick glue (SU-8 glue) ultraviolet light obliquely incident back photolithography process, which belongs to the field of computer simulation of thick glue photolithography process. Background technique [0002] SU-8 UV lithography is an important microfabrication technology for microelectromechanical systems (MEMS). It overcomes the problem of insufficient aspect ratio of ordinary photoresist lithography, and also overcomes the problem of extremely expensive X-ray light source in LIGA (German Lithographie, Galvanoformung, Abformung) technology. It is very suitable for manufacturing ultra-thick, high-depth and wide than the microstructure. In the traditional SU-8 adhesive UV vertical incidence lithography process, the mask plate and SU-8 adhesive are vertically aligned with the incident ultraviolet light, and only two-dimensional vertical SU-8 adhesive microstructures c...
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Inventor 周再发黄庆安李伟华
Owner SOUTHEAST UNIV
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