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Epoxy resin composition, cured object obtained therefrom, and light-emitting diode

一种环氧树脂、组合物的技术，应用在电固体器件、电气元件、电路等方向，能够解决增稠倍率高、固化速度快、作业性差等问题，达到增稠倍率低、固化性良好、着色少的效果

Active Publication Date: 2010-08-18
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, due to the high viscosity and fast curing speed of the epoxy resin compositions disclosed in these patent documents, the thickening ratio at room temperature during the working hours during the day is high and has the disadvantage of poor workability.

Method used

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  • Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
  • Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
  • Epoxy resin composition, cured object obtained therefrom, and light-emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] 79.0 parts by mass of H-TMAn [manufactured by Mitsubishi Gas Chemical Co., Ltd.], 21.0 parts by mass of a mixture of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride [MH700G produced by Shin Nippon Chemical Co., Ltd.], Alicyclic epoxy resin compound [3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexene carboxylate, Daicel Chemical Industry Co., Ltd. CEL2021P] 181 parts by mass, 47.8 parts by mass of hexane-1,6-diglycidyl ether [SR-16H manufactured by Sakamoto Pharmaceutical Co., Ltd.] as an epoxy resin compound represented by formula (1), hindered phenolic antioxidant AO-50 ( ADEKA Co., Ltd.) 2.6 parts by mass, the physical property measurement and evaluation of the obtained epoxy resin composition and its hardened|cured material were performed by the said method. The results are shown in Table 1.

Embodiment 2

[0115] Mix 87.0 parts by mass of H-TMAn, a mixture of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride [MH700G manufactured by Shin Nippon Chemical Co., Ltd.] 13.0 parts by mass, alicyclic epoxy resin compound [3 , 4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexene carboxylate, Daicel Chemical Industry Co., Ltd. product CEL2021P] 150.0 parts by mass, as an epoxy resin represented by formula (1) Compound hexane-1, 48.2 mass parts of 6-diglycidyl ether and 2.4 mass parts of hindered phenolic antioxidant AO-50 (manufactured by Co., Ltd. ADEKA), carry out the epoxy resin composition and its Measurement and evaluation of physical properties of cured products. The results are shown in Table 1.

Embodiment 3

[0117] Mix 52.0 parts by mass of H-TMAn, a mixture of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride [MH700G manufactured by Shin Nippon Chemical Co., Ltd.] 48.0 parts by mass, alicyclic epoxy resin compound [3 , 4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexene carboxylate, Daicel Chemical Industry Co., Ltd. product CEL2021P] 210 parts by mass, as an epoxy resin represented by formula (1) Compound hexane-1, 28.6 mass parts of 6-diglycidyl ether, hindered phenolic antioxidant AO-50 (manufactured by Co., Ltd. ADEKA) 2.7 mass parts, carry out the epoxy resin composition and its Measurement and evaluation of physical properties of cured products. The results are shown in Table 1.

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Abstract

Provided are an epoxy resin composition, cured objects thereof and a light-emitting diode, the epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics: (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)

Description

technical field [0001] The present invention relates to an epoxy resin composition suitable for sealing materials, paints, adhesives, and molded articles of photoelectric conversion elements represented by light-emitting diodes such as blue light-emitting diodes and white light-emitting diodes. Background technique [0002] In recent years, high-brightness blue light-emitting diodes and white light-emitting diodes (hereinafter referred to as "LEDs") have been developed, and are widely used in billboards, full-color displays, and backlights of mobile phones. Conventionally, a colorless and transparent anhydride-curable epoxy resin has been used as a sealing material for photoelectric conversion elements such as LEDs. [0003] As a curing agent for the epoxy resin used in the photoelectric conversion element, alicyclic acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride are generally used. [0004] However,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08G59/22H01L33/00H01L33/56
CPCH01L33/56C08G59/226C08G59/42C08L63/00C08G59/24H10K50/84C08L2666/22H10K50/8426
Inventor 佐藤隆上野修一小山刚司
Owner MITSUBISHI GAS CHEM CO INC
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