Room-temperature curing epoxy structural adhesive composition and preparation method thereof

A room temperature curing and adhesive technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of poor toughness, poor high temperature strength, etc., and achieve high shear strength, good adhesion, and T-peeling high intensity effect

Inactive Publication Date: 2010-09-01
HENKELCHINAINVESTMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the shortcomings of poor toughness and poor high temperature strength of the existing room temperature curing epoxy structural adhesive composition, and provide a room temperature curing epoxy structural adhesive composition with good toughness and high high temperature strength, And the preparation method of described epoxy structural adhesive

Method used

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  • Room-temperature curing epoxy structural adhesive composition and preparation method thereof
  • Room-temperature curing epoxy structural adhesive composition and preparation method thereof
  • Room-temperature curing epoxy structural adhesive composition and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] The preparation step of the CTBN modified epoxy resin used in embodiment 1 is: 100g liquid nitrile rubber (Hypro CTBN 1300 * 16, Emerald company) is joined in the 250g EPON828 epoxy resin, then adds 2g fumed silica ( TS-720, Cabot Company) and 2g of phenyltrimethoxysilane, firstly mix these components thoroughly at room temperature, then heat the mixture to 60°C at a heating rate of 2°C / min, at 60°C The reaction was carried out for 3 hours, then cooled to room temperature, and discharged.

[0032] The epoxy resin grade MX125 with core-shell structure polymer toughening is manufactured by Japan KANEKA Company.

[0033] Example 1:

[0034] Preparation of Room Temperature Curing Epoxy Structural Adhesive Composition:

[0035] (a) 10 grams of bisphenol A type Epon828 epoxy resin by weight ratio, 5.5 grams of core-shell structure polymer modified epoxy resin, 0.45 grams of phenyltrimethoxysilane, 0.6 grams of fumed silica, oxidized 0.1 g of iron, mechanically stirred and ...

Embodiment 2～10

[0050] Part A and Part B were prepared separately. The preparation method of component A and component B is as follows: according to the ingredients and dosage listed in Table 4, carry out mechanical stirring and dispersion at room temperature, and then put it into a high-speed shear mixing instrument with a vacuum device, first with 500 Stir mechanically at a speed of 300 rpm for 30 minutes, mix for 2 minutes while vacuuming at a speed of 300 rpm, and then mix for 60 seconds while vacuuming at a speed of 3000 rpm, then package and store.

[0051] The preparation steps of the CTBN modified epoxy resin used in embodiment 2,4 are: 100g liquid nitrile rubber (Hypro CTBN 1300 * 16, Emerald company) is joined in the 240g EPON826 epoxy resin, then add 3g gas phase dioxide Silicon (TS-720, Cabot Company) and 3g of phenyltrimethoxysilane, these components are mixed thoroughly at room temperature first, and then the mixture is heated to 70°C at a heating rate of 5°C / min. It was reacte...

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Abstract

The invention relates to a room-temperature curing epoxy structural adhesive composition, which comprises a component A and a component B, wherein the component A comprises bisphenol A epoxy resin, toughness modified bisphenol A epoxy resin, silane coupling agent, thixotropic agent and colorant; and the component B comprises polyamide, polyether amine, a filler and a curing accelerator; the toughness modified bisphenol A epoxy resin is liquid nitrile rubber-modified bisphenol A epoxy resin and / or polymer-toughened bisphenol A epoxy resin with a nuclear shell structure; meanwhile, the invention also provides a method for preparing the room-temperature curing epoxy structural adhesive compositiion. The structural adhesive of the invention has the advantages of good toughness, strong high-temperature strength, short curing time, simple preparation method, and the like.

Description

technical field [0001] The invention relates to a room temperature curing epoxy structural adhesive composition and a preparation method thereof. Background technique [0002] Room-temperature-curing epoxy adhesives have received widespread attention for a long time because of their time-saving, labor-saving, energy-saving, and easy-to-use advantages. Since the 1950s, along with the discussion and application of toughening technology and core-shell microstructure theory, significant progress has been made in the application research of epoxy resin adhesives in industry. Epoxy adhesives cured at room temperature have been widely used in aviation and aerospace equipment manufacturing, automobile, electrical, instrument manufacturing, architectural decoration, decoration, maintenance, medical and pharmaceutical packaging, and maintenance of daily necessities. It is one of the important varieties with wide application and large quantity in the field. [0003] The two-component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J177/00
CPCC08G59/46C08G2650/50C09J163/00C08G59/504C08G59/44C08L63/00C08L2205/02C08L71/02C08L77/00
Inventor 吴海平张敬芬李同年
Owner HENKELCHINAINVESTMENT
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