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High accuracy aluminum oxide polishing powder and production method thereof

An alumina polishing powder, high-precision technology, applied in alumina/aluminum hydroxide, polishing compositions containing abrasives, etc., can solve the problem of rapid separation and controlled separation results in industrialized large-scale production, gravity sedimentation separation time Long and other problems, to achieve the effect of easy control of stability, narrow particle size distribution, and small fluctuation of product quality

Inactive Publication Date: 2013-01-23
SHANGHAI GONA POWDER TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the separation time of gravity sedimentation is very long, which cannot meet the requirements of rapid separation and control of separation results in industrialized large-scale production.

Method used

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  • High accuracy aluminum oxide polishing powder and production method thereof
  • High accuracy aluminum oxide polishing powder and production method thereof
  • High accuracy aluminum oxide polishing powder and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] (1) Preparation of α-alumina: commercially available α-alumina A (characteristic parameters of particle size are as follows: D 10 : 2.50 μm, D 25 : 3.65 μm, D 50 : 5.42 μm, D 75 : 8.07 μm, D 90: 12.43 μm, D (3，2) : 4.64 μm, D (4，3) : 6.48μm), see figure 1 .

[0039] Through the OYF-400 jet mill of Shanmiyou Industrial Co., Ltd., the alumina product B suitable for grading was obtained.

[0040] The characteristic parameters of B granularity are as follows: D 10 : 0.79 μm, D 25 : 1.13 μm, D 50 : 1.71 μm, D 75 : 2.61 μm, D 90 : 3.88 μm, D (3，2) : 1.46 μm, D (4，3) : 2.02 μm. See figure 2 .

[0041] (2) Hydraulic centrifugal classification: Mix B and water to form a slurry with a weight solid content of 40%. After centrifugal classification by a DBS500 butterfly separator, slurry with different particle size distributions is obtained, and α with different particle size distributions are collected respectively. - slurries C' and slurries D' of alumina;

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Embodiment 2

[0049] (1) Preparation of α-alumina: select commercially available α-alumina A, (characteristic parameters of particle size are as follows: D 10 : 0.70 μm, D 25 : 0.89 μm, D 50 : 1.28 μm, D 75 : 1.85 μm, D 90 : 2.55 μm, D 100 : 13.31 μm, D (3，2) : 1.17 μm, D (4，3) : 1.56 μm). Particle size distribution see Figure 5 .

[0050] (2) Hydraulic centrifugal classification: A and water are mixed and beaten to form a slurry with a weight solid content of 5%, which is repeatedly centrifugally classified by a DBS500 butterfly separator, and the slurry C containing α-alumina with different particle size distributions is collected separately ' and Serum D';

[0051] The particle size distribution of slurry C' is as follows: D 50 =1.5±0.2μm, D 10 ≥0.5D 50 , D90≤2D 50 ,D 100 ≤3D 50

[0052] The particle size distribution of the slurry D' is as follows: D 50 =0.5±0.2μm, D 10 ≥0.5D 50 , D90≤2D 50 ,D 100 ≤3D 50

[0053] (3) Drying: respectively dry the slurry C' and the...

Embodiment 3

[0056] 74.2 parts by weight of C in Example 1, 25 parts of aluminum chloride, and 0.8 parts by weight of sodium lauryl sulfate were formulated with water into a slurry with a weight solid content of 0.5%, and were sheared and dispersed for 2 hours by a shearing machine. Taking laser disc master glass CD-ROM as the polishing object, the polishing test was carried out by Unipol polishing tester (equipment pressure: 26Mpa, rotation speed 650r / min). The roughness of the polished product is No scratches.

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Abstract

The invention discloses an aluminum oxide polishing powder and a production method thereof. The aluminum oxide polishing powder is characterized in that a D50 particle size is smaller than 2.0 microns and satisfies that D10 is no less than 0.5 times of D50, D90 is no more than 2 times of D50 and D100 is no less than 3 times of D50. The preparation method comprises the following steps of pulping raw materials of alpha-aluminum oxide with water, carrying out classification and obtaining a product. The aluminum oxide polishing powder has the advantages of small median particle diameter, narrow granularity distribution range, easy control of the polishing accuracy stability and small fluctuation of the product quality, can be used for accurate polishing processing of electronic product components including glasses for liquid crystal display screens, flat plane displays, optical elements, ultrathin glass substrates and glass magnetic discs and can also be used for preparing aluminum oxide polishing solution for polishing chemical machinery.

Description

technical field [0001] The invention relates to a high-precision alumina polishing powder and a production method thereof, more precisely, to an alumina polishing powder with a small median particle size, a narrow particle size distribution and high polishing precision and a production method thereof. Background technique [0002] With the progress of society and the rapid development of high-tech, the surface quality requirements of electronic products are constantly improving, and the surface planarization technology is also developing. Serious; Various deposition technologies have also been applied in integrated circuit technology, but they are all local planarization technologies, and their planarization capabilities range from a few microns to tens of microns, which cannot meet the global planarization requirements of small sizes. [0003] In 1991, IBM successfully applied chemical mechanical polishing (CMP) technology to the production of 64Mb DRAM for the first time, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02C01F7/02
Inventor 郝祥曹红霞赵月昌高玮杨筱琼张鹏顾捐永李冉
Owner SHANGHAI GONA POWDER TECH
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