Plasma body cleaning device

Abstract

The invention discloses a plasma body cleaning device, which mainly consists of a microwave system and a reaction device, wherein the microwave system comprises a microwave chamber, a microwave source and a microwave control circuit, the microwave source can be regulated and controlled through the microwave control circuit, and the regulation and the control on the density of the plasma body can be realized. The cleaning device effectively avoids the electrode pollution by adopting a microwave excitation mode, and simultaneously enlarges the pressure intensity work range. Because the microwave technology is mature, the microwave leakage can be easily controlled and protected, the cleaning device has good safety performance. The work pressure intensity can be controlled through regulating and controlling the flow speed of the cleaning reaction gas and the gas pumping speed of a vacuum device, the power of the microwave source can be controlled through the microwave control circuit, andthe bombarding force on the surface of cleaning samples by the plasma body and the concentration of the plasma body can be effectively regulated. Thereby, the cleaning and the surface modification indifferent modes can be carried out according to the cleaning samples in different material types.

Description

technical field [0001] The invention relates to a cleaning device, in particular to a plasma cleaning device. Background technique [0002] Surface cleaning technology plays a very important role in the processing of optical devices and microelectronic components. At present, the widely used physical and chemical cleaning methods can be roughly divided into two types from the perspective of operation mode: wet cleaning and dry cleaning. Wet cleaning mainly relies on physical and chemical (solvent) effects, such as the adsorption, soaking, dissolution, and dispersion of chemical active agents, supplemented by physical methods such as ultrasonic waves, spraying, rotation, boiling, steam, and shaking to remove dirt on the surface of objects. stains. In the wet cleaning process, subsequent drying and wastewater treatment processes are required, and the cost of labor protection and environmental pollution control is relatively high. Dry cleaning mainly includes plasma cleaning...

AI Technical Summary

Problems solved by technology

However, since plasma cleaning technology involves the research of plasma physics, plasma chemistry and material gas-solid phase interface characteristics, it needs to integrate various technologies such as chemical industry, materials and electronic machinery, so it is difficult to develop the technology

On the other hand, the corresponding existing plasma cleaning equipment also has some deficiencies, such as the capacitively coupled plasma cleaning device, although it can produce plasma with a larger diameter and the manufacturing process is relatively mature, but the plasma produced The density is not high, the working pressure range is narrow, and there is electrode pollution, which limits its application range to a certain extent

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