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Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer

A model, transfer medium technology, applied in the direction of nanotechnology for information processing, printing plate copying, printing, etc.

Inactive Publication Date: 2010-09-22
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of organic models has not been widely accepted as PDMS models

Method used

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  • Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer
  • Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer
  • Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer

Examples

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example

[0167] These examples are included to illustrate the present invention, and those skilled in the art will appreciate that, in light of the above disclosure, many changes may be made to the disclosed embodiments and still obtain a similar result. All amounts, ratios and percentages are expressed by weight unless otherwise specified. The following components were used in these examples.

[0168] Base Polymer A is 68% dimethylvinylsiloxy end-terminated polydimethylsiloxane, 31% dimethylvinylated and trimethylated silica, and 1% tetra( Trimethylsiloxy)silane mixtures.

[0169] Base Polymer B is 67% dimethylvinylsiloxy end-terminated polydimethylsiloxane, 31% dimethylvinylated and trimethylated silica, 1% tetra( A mixture of trimethylsiloxy)silane and 1% of impurities.

[0170] Base polymer C is a dimethylvinylsiloxy end-terminated polydimethylsiloxane.

[0171] Base polymer D is a dimethylvinylsiloxy end-terminated polydimethylsiloxane.

[0172] Base polymer E is 71% dimethy...

example 1

[0184] A polar additive (i.e., XUS13461 ethylene oxide propylene oxide (EO-PO) from Dow Chemical Company, Midland, Michigan, USA) was added to DOW 184 recipes. The amount of EO-PO is in the range of 1 to 20 weight percent. In these examples, it can be found that when the amount of EO-PO is Above 20 wt% in 184, the resulting pattern becomes too viscous to be used in some soft lithography processes.

[0185] After mixing EO-PO, the resulting composition was much better than that without EO-PO 184 is more viscous. A thermocompression curing method was used to fabricate models with microscale features. The pressure curing method forces the viscous composition into the master model to create high precision patterns in the polar model. After curing, as figure 1 As shown, in the modified PDMS model surface, the negative image of the patterned features from the original model was replicated.

[0186] After fabricating the modified PDMS phantom, surface energy measurements ...

example 3

[0193] Two-part samples were prepared by mixing the components in the amounts shown in Table 2 to form Parts A and B. Parts A and B were mixed in a 1:1 ratio. The molar SiH / Vi ratio of the mixture was 1.6. The resin / polymer ratio of the mixture was 0.45. The amount of resin in the mixture was 28%.

[0194] Table 2

[0195]

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PUM

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Abstract

A method includes the steps of (I) fabricating a cured silicone product and (II) using the cured silicone product in a patterning technique. The cured silicone product is a reaction product of (A) a silicone cure package and (B) is a polar additive having a polyalkylene oxide functionality and a reactive functionality. The method is useful in soft lithography applications.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C § 119(e) to U.S. Provisional Patent Application No. 60 / 983,251, filed October 29, 2007, the contents of which are hereby incorporated by reference . Background technique [0003] Polydimethylsiloxane (PDMS) patterns are widely used in soft lithography, especially for making stamps for microcontact printing (μCP) and soft (flexible) microforming processes. DOW 184 is the most common model building material used for these applications. PDMS offers several desirable properties, such as elasticity, conformal contact, low surface energy, good surface release, and transparency. In pattern transfer techniques, such as roll printing or μCP processes, the use of polar inks creates incompatibility issues between the ink and the hydrophobic PDMS model surface. In the microforming process, solvent-based polymers are used as printing media, and PDMS-based models have only limited...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00C08L83/12C08L83/04B41C3/04
CPCB82Y10/00C08G77/14G03F7/0002C08G77/20B82Y40/00C08G77/46C08G77/045C08G77/06C08L83/04C08G77/12C08L2666/14
Inventor 陈伟布莱恩·哈克尼斯迈克尔·斯坦格林载雄
Owner DOW CORNING CORP
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