The invention relates to a thermoelectric thick film preparation method. Thermoelectric thick film
slurry is composed of thermoelectric material particles, polymers and an
organic solvent. Due to the
polymer ratio, the thermoelectric thick film
slurry printed on a flexible substrate does not fall automatically after being dried, after the thermoelectric thick film
slurry is fully dried, one face with
viscose of a high temperature-resisting thin film is used for tight covering, and a thermoelectric thick film with excellent performance is acquired through cold isostatic pressing
processing. As the
polymer ratio is the lowest ratio which can only enable the thermoelectric thick film slurry printed on the flexible substrate not to fall automatically after being dried, attachment and molding of the thermoelectric thick film on the flexible substrate are acquired through the tightly-covered high temperature-resisting thin film and cold isostatic pressing
processing, the thermoelectric particles are fully and tightly contacted,
conductivity s close to that of a bulk can be acquired, the thermoelectric performance is improved, and due to protection of the high temperature-resisting thin film, the thermoelectric thick film is not likely to oxidize even if working for a long time at a temperature between
room temperature and 230 DEG C.