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Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board

A resin composition, photocurable technology, applied in printed circuit parts, optics, opto-mechanical equipment, etc., can solve the problems of lowering temperature, difficult to obtain high-viscosity compositions, etc., and achieves excellent stability over time, electrical The effect of excellent insulation and high insulation reliability

Active Publication Date: 2010-09-29
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the temperature must be lowered during filtration, making it difficult to obtain a high-viscosity composition

Method used

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  • Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board
  • Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board
  • Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board

Examples

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Embodiment

Synthetic example 1

Synthetic example 2

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Abstract

The invention provides a photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board. An alkali developable photocuring thermocuring resin composition contains (A) an epoxy resin, (B) a carboxyl-contained resin and (C) a photopolymerisable initiator, the epoxy resin (A) has a mixture of a bifunctional biphenyl epoxy resin (A-1) with a structure shown as the general formula (I) and an epoxy resin (A-2), the epoxy resin (A-2) is at least one epoxy resin with the softening point of 40 to 100 DEG C and the weight per epoxy equivalent of 180 to 300, selected from a bisphenol A type epoxy resin, a bisphenol A phenolic varnish type epoxy resin and a diphenol phenolic varnish type epoxy resin, The epoxy resin (A-1) is less than the epoxy resin (A-2). In the chemical formula 1, R is H or CH3.

Description

technical field The present invention relates to a photocurable thermosetting resin composition that can be developed by a dilute alkaline aqueous solution, and in particular to a composition for solder resist that is photocured by ultraviolet exposure or laser exposure, its dry film and cured product, and a composition formed using them. Printed circuit boards with cured film. Background technique Conventionally, alkali-developing type photosensitive resin compositions have been used in large quantities as solder resists for printed wiring boards. The purpose of using solder resist is to protect the surface circuit of the printed circuit board, which requires high solder heat resistance and electrical insulation. Furthermore, recently, the densification of printed circuit boards is remarkable, and the minimum circuit size of the circuit is 10 μm and the space is 10 μm, requiring higher insulation reliability than before. The existing alkali-developing solder resist consi...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/032H05K1/02
Inventor 椎名桃子有马圣夫
Owner TAIYO INK MFG
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