Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board

A resin composition, photocurable technology, applied in printed circuit parts, optics, opto-mechanical equipment, etc., can solve the problems of lowering temperature, difficult to obtain high-viscosity compositions, etc., and achieves excellent stability over time, electrical The effect of excellent insulation and high insulation reliability

Active Publication Date: 2010-09-29
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the temperature must be lowered during filtratio

Method used

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  • Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board
  • Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board
  • Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board

Examples

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Example

Examples and comparative examples are shown below to specifically describe the present invention. Of course, the present invention is not limited by the following examples. In addition, the following "parts" and "%", unless otherwise specified, all refer to quality standards.

Example Embodiment

[Chemical formula 1]

Into a 2-liter separable flask equipped with a mixer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen inlet tube, 660 g of cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, softened Point 92°C, epoxy equivalent 220), 421.3g carbitol acetate and 180.6g solvent naphtha, heat to 90°C and stir to dissolve. Then, once cooled to 60°C, 216g of acrylic acid, 4.0g of triphenylphosphine and 1.3g of methylhydroquinone were immediately added, and reacted at 100°C for 12 hours to obtain a reaction product with an acid value of 0.2mgKOH / g. 241.7g of tetrahydrophthalic anhydride was added to it, heated to 90°C, and reacted for 6 hours. Thus, a photosensitive carboxyl group-containing resin solution with an acid value of 50 mgKOH / g, a double bond equivalent (gram weight of the resin with an unsaturated group being 1 molar equivalent) of 400, and a weight average molecular weight of 7000 with a solid content concentra...

Example Embodiment

Synthesis Example 2 (Synthesis of carboxyl group-containing resin)

After dissolving 400 parts of bisphenol F solid epoxy resin with epoxy equivalent of 800 and softening point of 79°C with 925 parts of epichlorohydrin and 462.5 parts of dimethyl sulfoxide, add under stirring at 70°C 81.2 parts of 98.5% NaOH, addition continued for 100 minutes. After the addition, it was further reacted at 70°C for 3 hours. Then, most of the excess unreacted epichlorohydrin and dimethyl sulfoxide were distilled off under reduced pressure, and the reaction product containing the by-product salt and dimethyl sulfoxide was dissolved with 750 parts of methyl isobutyl ketone , Then add 10 parts of 30% NaOH and react at 70°C for 1 hour. After the reaction, it was washed twice with 200 parts of water. After oil-water separation, methyl isobutyl ketone was distilled and recovered from the oil layer to obtain 370 parts of epoxy resin (A-0) having an epoxy equivalent of 290 and a softening point of 62°...

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Abstract

The invention provides a photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board. An alkali developable photocuring thermocuring resin composition contains (A) an epoxy resin, (B) a carboxyl-contained resin and (C) a photopolymerisable initiator, the epoxy resin (A) has a mixture of a bifunctional biphenyl epoxy resin (A-1) with a structure shown as the general formula (I) and an epoxy resin (A-2), the epoxy resin (A-2) is at least one epoxy resin with the softening point of 40 to 100 DEG C and the weight per epoxy equivalent of 180 to 300, selected from a bisphenol A type epoxy resin, a bisphenol A phenolic varnish type epoxy resin and a diphenol phenolic varnish type epoxy resin, The epoxy resin (A-1) is less than the epoxy resin (A-2). In the chemical formula 1, R is H or CH3.

Description

technical field The present invention relates to a photocurable thermosetting resin composition that can be developed by a dilute alkaline aqueous solution, and in particular to a composition for solder resist that is photocured by ultraviolet exposure or laser exposure, its dry film and cured product, and a composition formed using them. Printed circuit boards with cured film. Background technique Conventionally, alkali-developing type photosensitive resin compositions have been used in large quantities as solder resists for printed wiring boards. The purpose of using solder resist is to protect the surface circuit of the printed circuit board, which requires high solder heat resistance and electrical insulation. Furthermore, recently, the densification of printed circuit boards is remarkable, and the minimum circuit size of the circuit is 10 μm and the space is 10 μm, requiring higher insulation reliability than before. The existing alkali-developing solder resist consi...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/032H05K1/02
Inventor 椎名桃子有马圣夫
Owner TAIYO INK MFG
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