The invention discloses an SiC-POSS-EP heat-conduction
hybrid material. The SiC-POSS-EP heat-conduction
hybrid material is characterized by being prepared from the following components in parts by weight: 40-80 parts of
epoxy resin EP, 30-60 parts of a curing agent, 0.1-10 parts of functional POSS (polyhedral oligomeric
silsesquioxane) and 1-20 parts of
silicon carbide (SiC). The invention further discloses a preparation method of the SiC-POSS-EP heat-conduction
hybrid material. The SiC-POSS-EP heat-conduction
hybrid material and the preparation method thereof disclosed by the invention have the beneficial effects that an organic material namely a functional POSS material and an inorganic material namely SiC are adopted, and the surface of POSS contains a large quantity of functional groups, so that the POSS material can be well compatible with matrix resin or chemically reacts with the matrix resin; the SiC has the advantages of being high in
hardness, resistant to high temperature, good in heat
conductivity, good in electrical insulating properties and the like; besides, the POSS can improve the quality of the interface of SiC heat conduction fillers and the
epoxy resin matrix, and reduce the reduction of interface
thermal resistance, so that the heat
conductivity of materials is improved; the POSS and the SiC are in synergistic effects, so that the
heat resistance, the mechanical properties, the
dielectric properties and the heat
conductivity of the matrix are finally improved; besides, compared with pure
epoxy resin and SiC filling epoxy
resin modified by common
coupling agents, the SiC-POSS-EP heat-conduction
hybrid material has the
advantage that the
impact strength, the bending modulus, the
dielectric properties and the
glass transition temperature particularly the heat conduction properties are greatly improved to a certain degree.