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Polyurethane pouring sealant capable of effectively improving heat conduction efficiency and preparation method thereof

A thermal conductivity, polyurethane technology, used in polyurea/polyurethane adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problem of inability to achieve effective heat dissipation of electronic components, and achieve effective heat dissipation and excellent electrical insulation. performance effect

Pending Publication Date: 2019-08-16
陈定方
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a polyurethane encapsulant that can effectively improve thermal conductivity and a preparation method, which solves the problem that the polyurethane encapsulant in the prior art has excellent electrical insulation properties and cannot achieve Technical Problems of Effective Heat Dissipation for Potted Electronic Components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Weigh 19g of vinyltriethoxysilane coupling agent, add to a solvent composed of 5g of distilled water and 15g of absolute ethanol, hydrolyze at room temperature for 30min, and prepare coupling agent A;

[0026] (2) Heat 8g of tetraisopropyl titanate into 8g of liquid paraffin, and after fully dissolving, prepare coupling agent B;

[0027] (3) Weigh 13g of aluminum nitride ceramics (AlN) with an average particle size of ≤25um, 7g of aluminum nitride ceramics (AlN) with an average particle size of ≤10um, and 5g of MgO with an average particle size of ≤25um to prepare filler components;

[0028] (4) Add the above filler components into a reactor equipped with a stirring device and a heating device, add 8g of fumed silica anti-sedimentation agent, stir at 80°C with a rotation speed of 300rpm, and slowly add coupling agent A, Turn to 600rpm and stir for 10min;

[0029] Switch to stirring at 300rpm, slowly add coupling agent B, then switch to stirring at 600rpm for 10 min...

Embodiment 2

[0035] (1) Weigh 19g of vinyltriethoxysilane coupling agent, add to a solvent composed of 5g of distilled water and 15g of absolute ethanol, hydrolyze at room temperature for 30min, and prepare coupling agent A;

[0036] (2) Heat 8g of tetraisopropyl titanate into 8g of liquid paraffin, and after fully dissolving, prepare coupling agent B;

[0037] (3) Weigh 20g of aluminum nitride ceramics (AlN) with an average particle diameter of ≤25um and 5g of MgO with an average particle diameter of ≤25um to prepare filler components;

[0038] (4) Add the above filler components into a reactor equipped with a stirring device and a heating device, add 8g of fumed silica anti-sedimentation agent, stir at 100°C with a rotation speed of 500rpm, and slowly add coupling agent A, Turn to 800rpm and stir for 10min;

[0039] Switch to stirring at 500rpm, slowly add coupling agent B, then switch to stirring at 800rpm for 10 minutes; after cooling, discharge the material, place the filler in a dry...

Embodiment 3

[0045] (1) Weigh 19g of vinyltriethoxysilane coupling agent, add it to a solvent consisting of 5g of distilled water and 15g of absolute ethanol, and hydrolyze it at room temperature for 30min to prepare coupling agent A;

[0046](2) Heat 8g of tetraisopropyl titanate into 8g of liquid paraffin, and after fully dissolving, prepare coupling agent B;

[0047] (3) Weigh 20g of aluminum nitride ceramics (AlN) with an average particle diameter of ≤10um and 5g of MgO with an average particle diameter of ≤25um to prepare filler components;

[0048] (4) Add the above-mentioned filler components into a reactor equipped with a stirring device and a heating device, add 8g of fumed silica anti-sedimentation agent, stir at 90°C with a rotation speed of 400rpm, and slowly add coupling agent A, Turn to 400rpm and stir for 10min;

[0049] Switch to stirring at 400rpm, slowly add coupling agent B, then switch to stirring at 700rpm for 10 minutes; discharge after cooling, place the filler in a...

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PUM

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Abstract

The invention relates to the technical field of polyurethane pouring sealant preparation, and discloses a polyurethane pouring sealant capable of effectively improving the heat conduction efficiency and a preparation method thereof. Micrometer level aluminum nitride ceramic particles with a high thermal conductivity coefficient are added into the raw material of polyurethane resin; at the same time, micrometer level MgO particles with a gelling effect are added; and all components carry out crosslinking curing reactions under the action of a silane coupling agent, a titanate coupling agent, afumed silica anti-settling agent, and an isophorone diisocyanate curing agent to prepare the polyurethane pouring sealant. Solved is the problem that in the prior art, a conventional polyurethane pouring sealant has an excellent electro-insulation performance but cannot effectively dissipate the heat generated by an electronic component sealed by the polyurethane pouring sealant.

Description

technical field [0001] The invention relates to the technical field of polyurethane potting glue preparation, in particular to a polyurethane potting glue capable of effectively improving heat conduction efficiency and a preparation method thereof. Background technique [0002] In the manufacturing process of integrated circuits, encapsulating integrated circuits is a very necessary step. Encapsulation is to use grouting materials to assemble the various parts that constitute electronic equipment according to requirements, to seal electronic components, and to keep electronic devices from the external environment. isolation. However, the heat dissipation of electronic components puts forward higher requirements for electronic potting adhesives, requiring electronic potting adhesives not only to have better electrical insulation properties, but also to have higher thermal conductivity. [0003] Polyurethane potting compound is a kind of block copolymer composed of polymer po...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J11/04C09J11/06C08G18/75C08G18/66C08G18/48C08G18/32
CPCC08G18/3206C08G18/3228C08G18/4825C08G18/6674C08G18/6677C08G18/6685C08G18/755C08K2003/282C08K2201/003C08K2201/014C09J11/04C09J11/06C09J175/08C08K13/02C08K3/28C08K3/22C08K3/36C08K5/5425C08K5/10
Inventor 陈定方
Owner 陈定方
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