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SiC-POSS-EP heat-conduction hybrid material and preparation method thereof

A technology of hybrid materials and functionalization, which is applied in the field of high thermal conductivity materials for PCB, can solve problems such as difficulty in exerting effect and easy agglomeration of nano-scale silicon carbide, and achieve low thermal expansion coefficient, high thermal conductivity and mechanical properties, and reduce the interface Effect of reducing thermal resistance

Inactive Publication Date: 2016-12-07
东莞上海大学纳米技术研究院 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nano-scale silicon carbide is very easy to agglomerate, and it is difficult to exert its due effect

Method used

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  • SiC-POSS-EP heat-conduction hybrid material and preparation method thereof
  • SiC-POSS-EP heat-conduction hybrid material and preparation method thereof
  • SiC-POSS-EP heat-conduction hybrid material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: This embodiment provides a SiC-POSS-EP thermally conductive hybrid material, which is made of the following components by weight:

[0032] Epoxy resin EP: 40-80 parts

[0033] Curing agent: 30-60 parts

[0034] Functionalized POSS: 0.1-10 parts

[0035] Silicon carbide SiC: 1-20 parts.

[0036] The epoxy resin is a mixture of one or more of bisphenol F epoxy resin, bisphenol A epoxy resin, bisphenol S epoxy resin and novolac epoxy resin.

[0037] The curing agent is a mixture of one or more of amines, phenolic resins, and acid anhydride curing agents, and the amines are diphenylmethanediamine.

[0038] Described functionalized POSS is cage octapolysilsesquioxane, and its structural formula is:

[0039]

[0040] In the functionalized POSS structural formula, at least one of the R groups is one of epoxy group, carboxyl group, acid anhydride, and amino group, and the remaining R groups are hydrogen atoms, halogen atoms, hydroxyl groups, C1-20 alkyl gro...

Embodiment 2

[0054] Embodiment 2: This embodiment provides a SiC-POSS-EP thermally conductive hybrid material for PCBs, and a method for preparing the SiC-POSS-EP thermally conductive hybrid material. The components and steps are basically the same as in Example 1, and the The difference is:

[0055] A SiC-POSS-EP thermally conductive hybrid material, which is made of the following components in parts by weight:

[0056] Bisphenol S type epoxy resin: 40 parts

[0057] Methyl hexahydrophthalic anhydride: 30 parts

[0058] Cage-shaped octaaminophenylsilsesquioxane: 0.1 parts

[0059] 20nm silicon carbide SiC: 1 part.

[0060] A preparation method according to the SiC-POSS-EP thermally conductive hybrid material, which comprises the following steps:

[0061] (1) prepare each component by following parts by weight:

[0062] Bisphenol S type epoxy resin: 40 parts

[0063] Methyl hexahydrophthalic anhydride: 30 parts

[0064] Cage-shaped octaaminophenylsilsesquioxane: 0.1 parts

[0065] ...

Embodiment 3

[0069] Example 3: This example provides a SiC-POSS-EP thermally conductive hybrid material for PCBs, and a method for preparing the SiC-POSS-EP thermally conductive hybrid material. The components and steps are basically the same as those in Examples 1 and 2. , which differ in that:

[0070] A SiC-POSS-EP thermally conductive hybrid material, which is made of the following components in parts by weight:

[0071] Bisphenol F type epoxy resin: 80 parts

[0072] Diphenylmethanediamine: 60 parts

[0073] Cage octasilsesquioxane: 10 parts

[0074] 100nm silicon carbide SiC: 20 parts.

[0075] A preparation method according to the SiC-POSS-EP thermally conductive hybrid material, which comprises the following steps:

[0076] (1) prepare each component by following parts by weight:

[0077] Bisphenol F type epoxy resin: 80 parts

[0078] Diphenylmethanediamine: 60 parts

[0079] Cage octasilsesquioxane: 10 parts

[0080] 100nm silicon carbide SiC: 20 parts;

[0081] (2) Mix ...

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Abstract

The invention discloses an SiC-POSS-EP heat-conduction hybrid material. The SiC-POSS-EP heat-conduction hybrid material is characterized by being prepared from the following components in parts by weight: 40-80 parts of epoxy resin EP, 30-60 parts of a curing agent, 0.1-10 parts of functional POSS (polyhedral oligomeric silsesquioxane) and 1-20 parts of silicon carbide (SiC). The invention further discloses a preparation method of the SiC-POSS-EP heat-conduction hybrid material. The SiC-POSS-EP heat-conduction hybrid material and the preparation method thereof disclosed by the invention have the beneficial effects that an organic material namely a functional POSS material and an inorganic material namely SiC are adopted, and the surface of POSS contains a large quantity of functional groups, so that the POSS material can be well compatible with matrix resin or chemically reacts with the matrix resin; the SiC has the advantages of being high in hardness, resistant to high temperature, good in heat conductivity, good in electrical insulating properties and the like; besides, the POSS can improve the quality of the interface of SiC heat conduction fillers and the epoxy resin matrix, and reduce the reduction of interface thermal resistance, so that the heat conductivity of materials is improved; the POSS and the SiC are in synergistic effects, so that the heat resistance, the mechanical properties, the dielectric properties and the heat conductivity of the matrix are finally improved; besides, compared with pure epoxy resin and SiC filling epoxy resin modified by common coupling agents, the SiC-POSS-EP heat-conduction hybrid material has the advantage that the impact strength, the bending modulus, the dielectric properties and the glass transition temperature particularly the heat conduction properties are greatly improved to a certain degree.

Description

technical field [0001] The invention relates to a high thermal conductivity material for PCB, in particular to a SiC-POSS-EP thermal conductivity hybrid material and a preparation method of the SiC-POSS-EP thermal conductivity hybrid material. Background technique [0002] Epoxy resin is one of the important thermosetting materials. Because of its excellent thermal stability, mechanical properties and easy processability, it is widely used in the fields of adhesives, electronic packaging materials, coatings and aerospace, especially in PCB boards. However, epoxy resins still have many deficiencies, such as greater brittleness due to high cross-linking density, heat resistance and strength to be improved and so on. The cost of synthesizing a new type of high-performance epoxy resin is very high, and adding modifiers to the original epoxy resin matrix through grafting, copolymerization, and blending can save costs and improve certain epoxy resin properties. properties and is...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/549C08K3/34
Inventor 付继芳陈立亚尚大鹏殷金涛宗培松黄雷洪诗斌施利毅柴颂刚苏晓声杜鸣翠
Owner 东莞上海大学纳米技术研究院
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