SiC-POSS-EP heat-conduction hybrid material and preparation method thereof
A technology of hybrid materials and functionalization, which is applied in the field of high thermal conductivity materials for PCB, can solve problems such as difficulty in exerting effect and easy agglomeration of nano-scale silicon carbide, and achieve low thermal expansion coefficient, high thermal conductivity and mechanical properties, and reduce the interface Effect of reducing thermal resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0031] Embodiment 1: This embodiment provides a SiC-POSS-EP thermally conductive hybrid material, which is made of the following parts by weight:
[0032] Epoxy resin EP: 40-80 parts
[0033] Curing agent: 30-60 parts
[0034] Functionalized POSS: 0.1-10 copies
[0035] Silicon carbide SiC: 1-20 parts.
[0036] The epoxy resin is a mixture of one or more of bisphenol F epoxy resin, bisphenol A epoxy resin, bisphenol S epoxy resin, and novolac epoxy resin.
[0037] The curing agent is a mixture of one or more of amines, phenolic resins, and acid anhydride curing agents, and the amines are diphenylmethanediamine.
[0038] The functionalized POSS is cage octasilsesquioxane, and its structural formula is:
[0039]
[0040] In the functionalized POSS structural formula, at least one of the R groups is one of epoxy, carboxyl, acid anhydride, and amino groups, and the remaining R groups are hydrogen atoms, halogen atoms, hydroxyl groups, C1-20 alkyl groups, and alkenes. One or a combination of a...
Example Embodiment
[0054] Embodiment 2: This embodiment provides a SiC-POSS-EP thermally conductive hybrid material for PCB, and a preparation method of the SiC-POSS-EP thermally conductive hybrid material. Its components and steps are basically the same as those of Embodiment 1. the difference lies in:
[0055] A SiC-POSS-EP thermally conductive hybrid material, which is made of each component in parts by weight as follows:
[0056] Bisphenol S type epoxy resin: 40 parts
[0057] Methylhexahydrophthalic anhydride: 30 parts
[0058] Cage octaaminophenyl silsesquioxane: 0.1 part
[0059] 20nm silicon carbide SiC: 1 part.
[0060] A preparation method according to the SiC-POSS-EP thermally conductive hybrid material, which comprises the following steps:
[0061] (1) Prepare the components according to the following parts by weight:
[0062] Bisphenol S type epoxy resin: 40 parts
[0063] Methylhexahydrophthalic anhydride: 30 parts
[0064] Cage octaaminophenyl silsesquioxane: 0.1 part
[0065] 20nm silicon carbi...
Example Embodiment
[0069] Embodiment 3: This embodiment provides a SiC-POSS-EP thermally conductive hybrid material for PCB and a preparation method of the SiC-POSS-EP thermally conductive hybrid material. The components and steps are basically the same as those of Examples 1 and 2 , The difference is:
[0070] A SiC-POSS-EP thermally conductive hybrid material, which is made of each component in parts by weight as follows:
[0071] Bisphenol F type epoxy resin: 80 parts
[0072] Diphenylmethane diamine: 60 parts
[0073] Cage octasilsesquioxane: 10 parts
[0074] 100nm silicon carbide SiC: 20 parts.
[0075] A preparation method according to the SiC-POSS-EP thermally conductive hybrid material, which comprises the following steps:
[0076] (1) Prepare the components according to the following parts by weight:
[0077] Bisphenol F type epoxy resin: 80 parts
[0078] Diphenylmethane diamine: 60 parts
[0079] Cage octasilsesquioxane: 10 parts
[0080] 100nm silicon carbide SiC: 20 parts;
[0081] (2) Mix the pre...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap