Plastic composition and plastic surface metallizing method

Abstract

The invention provides a plastic composition and a plastic surface metallizing method. The plastic composition contains plastic matrix resin and metal chelate; the metal chelate is a complex of metal ions and organic chelating agent; and the organic chelating agent is at least one of diketone, aminocarboxylic acid, thiocarboxylic acid, polycarboxylic acid and nitrogen-containing heterocyclic compound with a general formula CnH8N2, wherein n is 10, 12 or 14. The plastic surface metallizing method comprises the following steps of: performing injection molding on the plastic composition provided by the invention to form a plastic piece, then performing laser etching on the plastic piece by adopting laser with wavelength of 1,064 nanometers to 1,000 microns, and chemically plating a laser etching area to form a metal plating layer. The organic chelating agent adopted in the plastic composition has low cost and is sensitive to the laser, so the plastic surface has high activation degree; and when the plastic surface is metallized, the infrared laser with lower cost is adopted so that the metal ions of the metal chelate in the plastic piece are decomposed as an active center of subsequent chemical plating and the precision is very high.

Description

【Technical field】 [0001] The invention relates to a method for metallizing the surface of non-metallic materials, in particular to a method for laser-induced metallization of plastic surfaces. 【Background technique】 [0002] LDS-MID is a technology that uses laser direct structuring (Laser Direct Structuring-LDS) to manufacture plastic parts with partially or fully metallized surfaces. [0003] A laser-induced selective electroless plating method is disclosed in the prior art. The method adopts polyvinylpyrrolidone / silver colloid to be coated on the substrate, and ultraviolet laser is used for selective radiation, and the silver ions in the colloidal silver in the irradiated area are It is reduced to metallic silver particles and embedded in the substrate, the colloidal silver in the unirradiated area is washed away, and then the electroless plating is performed to obtain a micron-scale patterned electroless plating layer on the substrate. Since the silver nitrate, silver f...

AI Technical Summary

Problems solved by technology

The organic complexing agent in the heavy metal complex used in this method is expensive, and some of the complexes are not sensitive to ultraviolet lasers, making the final circuit structure unclear

And in this method, expensive palladium is used to cooperate with an organic complexing agent, so that the process cost is also relatively high

[0005] In addition, in the prior art, ultraviolet laser irradiation is used to metallize the surface of the plastic substrate, but the ultraviolet laser is expensive

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