Photosensitive resin composition, and dry film and printed wiring board using the same

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of reduced insulation resistance of cured coating film, difficult completion of reaction, insignificant effect of electrical insulation, etc., and achieves excellent touch dryness, Effects of high ion migration resistance and excellent electrical insulation

Inactive Publication Date: 2010-10-06
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The purpose of this photosensitive resin composition is to insert a thermal polymerization catalyst into the inorganic layered compound to improve the storage stability of the solder resist, but the effect of electrical insulation is not significant
It is generally considered that when a thermal polymerization catalyst is inserted

Method used

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  • Photosensitive resin composition, and dry film and printed wiring board using the same
  • Photosensitive resin composition, and dry film and printed wiring board using the same
  • Photosensitive resin composition, and dry film and printed wiring board using the same

Examples

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Embodiment

[0176] The present invention will be specifically described below by showing examples and comparative examples, but of course the present invention is not limited to the following examples. In addition, the following "parts" and "%" refer to mass standards unless otherwise specified.

Synthetic example 1

[0177] Synthesis example 1 (synthesis of carboxyl group-containing resin (B))

[0178] 360 g (0.45 mol) of polycarbonate derived from 1,5-pentanediol and 1,6-hexanediol as a compound having two or more alcoholic hydroxyl groups were charged into a reaction vessel equipped with a stirring device, a thermometer, and a condenser Diol (manufactured by Asahi Kasei Chemicals Corporation, TJ5650J, number average molecular weight 800), 81.4 g (0.55 mol) of dimethylolbutanoic acid, and 11.8 g (0.16 mol) of n-butyl as a molecular weight regulator (reaction terminator) alcohol. Then, 200.9 g (1.08 moles) of trimethylhexamethylene diisocyanate was added as an isocyanate compound without an aromatic ring, heated to 60°C while stirring, then stopped, and when the temperature in the reaction vessel began to drop, it was heated again. Stirring was continued at 80°C, and the absorption spectrum of the isocyanate group was confirmed by infrared absorption spectrum (2280cm -1 ) disappears, t...

Synthetic example 2

[0179] Synthesis example 2 (synthesis of carboxyl group-containing resin (B))

[0180] 2400 g (3 moles) of polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol (manufactured by Asahi Kasei Chemicals Corporation, TJ5650J) were charged into a reaction vessel equipped with a stirring device, a thermometer, and a condenser. , number average molecular weight 800), 603 g (4.5 moles) of dimethylolpropionic acid, and 238 g (2.6 moles) of 2-hydroxyethyl acrylate as a monohydroxy compound. Then, 1887g (8.5 moles) of isophorone diisocyanate as a polyisocyanate was added, heated to 60°C while stirring, and then stopped, and when the temperature in the reaction vessel began to drop, it was heated again, and the stirring was continued at 80°C. The absorption spectrum confirms the absorption spectrum of the isocyanate group (2280cm -1 ) disappears, the reaction ends. Carbitol acetate was added so that the solid content would be 50% by mass. This is referred to as B-2 varni...

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Abstract

The invention provids a photosensitive resin composition, and a dry film and a printed wiring board using the same, particularly the photosensitive resin composition, its dry film and the printed wiring board made of a cured film such as a solder resist manufatured by them, wherein the cured film such as the solder resist could prevent the ion migration in a fine space circuit. The dry film of the photosensitive resin composition has excellent finger contact drying property, scolder hear resistance, chemical gilding resistance and electrical insulation. The photosensitive resin composition with an alkaline developing property includes an carboxyl-contained resin (B), an photopolymerizable initiator (D), layer-shaped double hydroxides (A) preferably brucite, preferably a compound (C) with alkene unsaturated group; additionally adding a thermal cured component (E), a light cured and thermal cured resin composition is formed.

Description

technical field [0001] The present invention relates to a photosensitive resin composition which is excellent in dry-to-touch property of the dried coating film, can obtain a cured product excellent in solder heat resistance, electroless gold plating resistance, electrical insulation, etc. Cured film such as solder resist film for ion migration in the circuit. The present invention also relates to a dry film and a cured product using the photosensitive resin composition, and a printed wiring board having a cured film formed using them. Background technique [0002] Conventionally, alkali-developing type photosensitive resin compositions have been used in large quantities as solder resists for printed wiring boards. Solder resists are used for the purpose of protecting the surface circuits of printed circuit boards, and require high solder heat resistance and electrical insulation. In particular, recently, the density of printed circuit boards has been significantly increas...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/032H05K3/28
CPCC08F283/006C08F290/062C08F299/022C08G63/21G03F7/0047G03F7/027G03F7/038G03F7/0388
Inventor 冈本大地有马圣夫
Owner TAIYO INK MFG
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