Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing method of high-strength E0 grade middle-high density plate

A technology of high-density boards and processing methods, applied in wood processing appliances, manufacturing tools, wood treatment, etc., can solve the problems of high curing temperature, difficult balance, and slow curing speed of phenolic resin, and achieve low content of free aldehydes and free phenols , The production process is stable and the effect of good weather resistance

Inactive Publication Date: 2010-10-20
DONGYING ZHENGHE WOOD IND
View PDF4 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the field of wood processing, phenolic resin has been successfully used in the production of plywood and particleboard, but in the medium and high density fiberboard industry, phenolic resin is rarely used. High risk factor, severe reaction, difficult to control
Second, the control of free phenol and free aldehyde in the finished phenolic resin is more difficult, and it is difficult to balance the two
Third, the curing temperature of phenolic resin is high and the curing speed is slow. When using phenolic resin to manufacture medium and high-density fiberboards, the hot pressing process is relatively harsh and difficult to adjust

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing method of high-strength E0 grade middle-high density plate
  • Processing method of high-strength E0 grade middle-high density plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Embodiment 1: Wash the clean logs with a length of 40 mm, a width of 15 mm, and a thickness of 2 mm to remove impurities such as silt on the surface of the wood chips. The washed wood chips are sent to the pre-cooking vat by the wood chip pump for initial softening, and then sent to the cooking vat for further softening through the cork screw. The steam pressure in the cooking vat is 0.70Mpa, and the pressure of the grinding chamber is about 0.01Mpa lower than that of the cooking vat. The grinding quality of the fiber is improved through the pressure difference, and the cooking time is 3 minutes. After the wood chips are fully cooked, they enter the grinding chamber of the heat refiner to defiber. The fiber is applied with modified phenolic resin according to the ratio of solid modified phenolic resin glue to 12% of the absolute dry fiber mass, and the solid paraffin is applied according to the amount of 0.5% of the absolute dry fiber mass. Applying, the mass of the liq...

Embodiment 2

[0011] Embodiment 2: Wash the clean logs with a length of 60 mm, a width of 30 mm, and a thickness of 6 mm to remove impurities such as silt on the surface of the wood chips. The washed wood chips are sent to the pre-cooking vat by the wood chip pump for initial softening, and then sent to the cooking vat for further softening through the cork screw. The steam pressure in the cooking vat is 0.80Mpa, and the pressure of the grinding chamber is about 0.02Mpa lower than that of the cooking vat. The grinding quality of the fiber is improved through the pressure difference, and the cooking time is 5 minutes. After the wood chips are fully cooked, they enter the grinding chamber of the thermal refiner to defiber, and the fiber is applied with modified phenolic resin according to the ratio of solid modified phenolic resin glue to 18% of the absolute dry fiber mass, and solid paraffin is applied according to the amount of 1.5% of the absolute dry fiber mass. Applying, the liquid forma...

Embodiment 3

[0012] Embodiment 3: Wash the clean logs with a length of 50 mm, a width of 20 mm, and a thickness of 5 mm to remove impurities such as silt on the surface of the wood chips. The washed wood chips are sent to the pre-cooking vat by the wood chip pump for initial softening, and then sent to the cooking vat for further softening through the cork screw. The steam pressure in the cooking vat is 0.75Mpa, and the pressure of the grinding chamber is about 0.015Mpa lower than that of the cooking vat. The grinding quality of the fiber is improved through the pressure difference, and the cooking time is 5 minutes. After the wood chips are fully cooked, they enter the grinding chamber of the thermal refiner to defiber, and the fiber is applied with a modified phenolic resin according to the ratio of the solid modified phenolic resin glue to 15% of the dry fiber mass, and the solid paraffin is applied according to 1% of the dry fiber mass. Applying, the mass of the liquid formaldehyde sca...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a processing method of a high-strength E0 grade middle-high density plate, comprising the following steps of: controlling the pressure and the time in the stewing and softening working procedure based on the traditional processing method; controlling the pressure of a grinding chamber in the hot rolling work procedure; mixing phenolic resin adhesive with paraffin and a liquid formaldehyde tapping agent in the sizing work procedure; and controlling the dried fiber water-containing rate, the hot-pressing temperature, hot-pressing factors, the density control and other conditions and innovating. The invention particularly provides a preparation method for improving the phenolic resin adhesive, thereby having the specific advantages that the phenolic resin adhesive isstable in the production process and is easy to control and the contents of free aldehyde and free phenol of adhesive liquid are low. The formaldehyde release quantity of a fiber board produced by using modified phenolic resin reaches the European E0 standard; various indexes reach national standard; and the invention has favorable weather resistance and can be used outdoors.

Description

technical field [0001] The invention relates to the technical field of artificial board processing methods, in particular to a processing method for applying a phenolic resin adhesive to high-strength E0 outdoor medium and high-density fiberboards. Background technique [0002] With the development of society and the change of people's lifestyle, fiberboard is widely used in the fields of furniture, interior decoration and packaging materials. Compared with petrochemical and metal materials, fiberboard has many advantages such as low cost and renewable raw materials. The existing MDF production methods mainly include wood chips screening, washing, cooking, grinding and pressing, glue mixing, drying, paving and molding, hot pressing and other main processes, as well as edge cutting, cross-sawing, cooling, stacking, curing, and sanding. , sawing and other auxiliary processes. Among them, the glue used in the glue application process is the key to the quality of the density b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B27K5/06B27K1/00
Inventor 李杰李林
Owner DONGYING ZHENGHE WOOD IND
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com