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Rotary positioning mechanism of LED die bonder

A technology of positioning mechanism and die bonding machine, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of wafer vibration and low wafer positioning accuracy, and achieves convenient installation and debugging, easy remote control, and difficult wear effect

Inactive Publication Date: 2011-12-14
SHENZHEN WISDOW REACHES IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the disadvantages of the low positioning accuracy of the wafer disc in the prior art and cause the wafer disc to vibrate, and provide a rotary positioning mechanism for an LED die bonder

Method used

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  • Rotary positioning mechanism of LED die bonder
  • Rotary positioning mechanism of LED die bonder
  • Rotary positioning mechanism of LED die bonder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0022] The electromagnetic brake provided in this embodiment is an energized electromagnetic eddy current brake, and the turntable shaft brake assembly is an electromagnetic brake assembly, including an energized brake electromagnetic brake and its mounting plate 2, and the electromagnetic brake 1 is installed on the turntable shaft 12. To reduce the braking torque and structural size. The electromagnetic brake is an electromagnetic eddy current brake with a dynamic friction torque of 0.5Kg / m and a static friction torque of 0.6Kg / m. The rotary positioning mechanism is installed on the wafer XY workbench, which is directly driven by the wafer XY workbench. When the suction nozzle at the tip of the swing arm of the welding head picks up the wafer from the wafer tray 6 to the bonding position and replaces the wafer on the next wafer tray 6 after bonding, the stepping motor 11 drives the turntable shaft 12 to rotate, driven by the transmission belt 7 The indexing synchronous wheel...

Embodiment 3

[0025] The electromagnetic brake provided in this embodiment is an energized electromagnetic friction brake, and the turntable shaft brake assembly is an electromagnetic brake assembly, including an energized brake type electromagnetic brake and its mounting plate 2, and the electromagnetic brake 1 is installed on the turntable shaft 12 to Reduced braking torque and structural size. Electromagnetic brake 1 is an electromagnetic friction brake with a dynamic friction torque of 0.5Kg / m and a static friction torque of 0.6Kg / m. The rotary positioning mechanism is installed on the wafer XY workbench, and the work is directly driven by the wafer XY workbench. , when the suction nozzle at the tip of the welding head swing arm picks up the wafer from the wafer tray 6 to the solid crystal position and replaces the wafer of the next wafer tray 6 after the bonding is completed, the stepping motor 11 drives the turntable shaft 12 to rotate, and the drive belt 7 The indexing synchronous wh...

Embodiment 4

[0028] The electromagnetic brake provided in this embodiment is a power-off braking type electromagnetic powder brake, and the turntable shaft brake assembly is an electromagnetic brake assembly, including a power-off braking type electromagnetic brake and its mounting plate 2, and the electromagnetic brake is installed on the turntable shaft 12 , to reduce the braking torque and structural size. The electromagnetic brake is an electromagnetic powder brake with a dynamic friction torque of 0.5Kg / m and a static friction torque of 0.6Kg / m. The rotary positioning mechanism is installed on the wafer XY workbench, which is directly driven by the wafer XY workbench. When the suction nozzle at the tip of the welding head’s swing arm picks up the wafer from the wafer tray 6 to the bonding position and replaces the next wafer on the wafer tray 6 after bonding, the stepping motor 11 drives the turntable shaft 12 to rotate, driven by the transmission belt 7 The indexing synchronous wheel...

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PUM

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Abstract

The invention provides a rotary positioning mechanism of an LED die bonder. The rotary positioning mechanism comprises a mounting board, a turntable support board for supporting a turntable board, a step motor, a mounting seat of the step motor, a turnplate driven by the step motor, a turnplate shaft of the turnplate, a transmission belt, a wafer disk, and a turnplate shaft braking component, wherein the mounting seat is arranged on the turntable board; the wafer disk is arranged on the turnplate; the wafer disk for holding a wafer is driven by the transmission belt; the transmission belt is arranged on a 60-tooth indexing synchronous wheel and a 14-tooth indexing synchronous wheel; and the turnplate shaft braking component is an electromagnetic braking component. The rotary positioning mechanism has the advantages of sensitive response, high positioning precision, abrasive resistance, long service life, low cost, convenient installation and debugging and easy remote control, and has the functions of accurately indexing, positioning and braking and effectively preventing shake.

Description

technical field [0001] The invention relates to a rotary positioning mechanism of post-packaging mechanical equipment on an LED production line, in particular to a rotary positioning mechanism of an LED die bonding machine. Background technique [0002] LED chip bonder, commonly known as LED die bonder, is one of the key mechanical equipment necessary for the post-packaging process on the LED production line. Its mechanical parts include welding head assembly, thimble assembly, wafer table assembly, optical system, oxide dispensing assembly and rotary positioning mechanism assembly. Among them, the rotary positioning mechanism is installed on the XY table of the wafer, and the work is directly driven by the XY table of the wafer. When the suction nozzle button sucks up the wafers of one wafer tray and replaces the wafers of the next wafer tray, the rotary positioning mechanism rotates and indexes to the next target wafer tray, the stepping motor stops, and the XY table move...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 王鸿罗会才陈小宇梁杰坤
Owner SHENZHEN WISDOW REACHES IND
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