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Pellicle frame and lithographic pellicle

一种防护膜、防护胶膜的技术,应用在光学、用于光机械处理的原件、仪器等方向,能够解决图像形变、曝光装置散焦、图像变形等问题,达到减轻变形的效果

Active Publication Date: 2010-12-29
SHIN ETSU CHEM CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] When the mask is deformed, the flatness of the mask may deteriorate, and in this case, defocusing may occur in the exposure device
On the other hand, although there are cases where mask deformation improves the flatness, even in such cases, the pattern formed on the mask surface will be deformed, and as a result, there may be defects that are transferred to the wafer during exposure. The image of the image will also have the problem of deformation
The deformation of the pattern also occurs when the flatness of the mask is deteriorated. Therefore, as a result, when the mask is deformed by attaching the pellicle, the problem of image deformation will inevitably occur.

Method used

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  • Pellicle frame and lithographic pellicle
  • Pellicle frame and lithographic pellicle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Dissolve Cytop CTX-S (trade name of Asahi Glass Co., Ltd.) in perfluorotributylamine to obtain a 5% solution, drop this solution on a silicon wafer, and spread it by spinning the wafer at 830 rpm by the spin coating method on the chip. Then, after drying at room temperature for 30 minutes, drying was carried out at 180° C. to form a uniform film. The aluminum frame coated with the adhesive is attached to this film, and only the film is peeled off to make a protective film. A desired number of the above-mentioned Cytop CTX-S membranes were prepared and used in Examples 1 to 10 and Comparative Examples.

[0095] Made of aluminum alloy (hereinafter referred to as "Al alloy"), the external dimensions are 149mm x 122mm x 3.5mm, and the width of the upper and lower sides is 2mm (the cross-sectional shape is as follows: image 3 As shown in (a), the cross-sectional area is 3.25mm 2 ) of the protective film frame. It should be noted that the cross-sectional shape is I-shape...

Embodiment 2

[0101] Made of aluminum alloy, the overall size is 149mm×115mm×3.0mm, and the width of the upper and lower sides is 2mm (the cross-sectional shape is as follows image 3 As shown in (a), the cross-sectional area is 3.00mm 2 ) of the protective film frame. The flatness of the frame was measured from the side on which the mask adhesive was applied, and the flatness was 10 μm. A mask adhesive is applied to one end of the frame, and a film adhesive is applied to the other end. Then, the previously peeled pellicle film was bonded to the film adhesive side of the aluminum alloy frame, and the film on the outer periphery of the frame was cut to form a pellicle.

[0102] The produced pellicle was bonded to a square mask with a side length of 142 mm and a flatness of 0.25 μm under a load of 20 kg. Then, the flatness of the pellicle-attached mask was measured again, and the flatness became 0.24 μm. In addition, although the maximum deformation range changed by 30 nm, it was suppress...

Embodiment 3

[0104] Made of magnesium alloy (hereinafter referred to as "Mg alloy"), the external dimensions are 149mm x 122mm x 3.5mm, and the width of the upper and lower sides is 2mm (the cross-sectional shape is as follows image 3 As shown in (a), the cross-sectional area is 3.25mm 2 ) of the protective film frame. The flatness of the frame was measured from the side on which the mask adhesive was applied, and the flatness was 20 μm. A mask adhesive is applied to one end of the frame, and a film adhesive is applied to the other end. Then, the previously peeled pellicle film was bonded to the film adhesive side of the magnesium alloy frame, and the film on the outer periphery of the frame was cut to form a pellicle.

[0105] The produced pellicle was bonded to a square mask with a side length of 142 mm and a flatness of 0.25 μm under a load of 20 kg. Then, the flatness of the pellicle-attached mask was measured again, and the flatness became 0.24 μm. In addition, although the maxim...

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Abstract

It is an object of the present invention to provide a pellicle frame that can suppress deformation of an exposure master plate due to deformation of the pellicle frame even if a pellicle is affixed to the exposure master plate, and a lithographic pellicle having such a pellicle frame. The pellicle frame is characterized in that the pellicle frame bar has a quadrilateral cross-section, wherein an upper edge and a lower edge of a basic quadrilateral forming said cross-section are parallel to each other and each of side edges of the basic quadrilateral has one quadrilateral recess. Furthermore the lithographic pellicle is characterized in that the pellicle film is stretched over one end face of the pellicle frame via a pellicle film adhesive, and an exposure master plate is adhesive on the other end face.

Description

technical field [0001] The present invention relates to a pellicle and a pellicle frame for lithography used as a dust shield for a lithography mask when manufacturing semiconductor devices such as LSI and super LSI, or liquid crystal display panels. Background technique [0002] In the manufacture of semiconductors such as LSI and super LSI, or the manufacture of liquid crystal display panels, etc., light is irradiated on semiconductor wafers or original plates for liquid crystals to create patterns. However, if dust is attached to the exposure master used at this time, the dust will absorb light. Or deflect the light, thus causing the pattern after transfer to be deformed or the edges to become rough. In addition, the substrate will be polluted and blackened, which will damage the size, quality, and appearance. In addition, in this invention, an "exposure master" is a generic term for a mask for lithography (it is also simply referred to as a "mask") and a reticle. Take t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/14B65D85/86G03F1/64H01L21/027
CPCG03F1/64G03F1/142G03F1/62H01L21/0274
Inventor 白崎享戴维·穆舍尔基肖尔·查克拉瓦蒂格蕾斯·额
Owner SHIN ETSU CHEM CO LTD
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