Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip resistor and manufacturing method thereof and communication equipment

A technology of chip resistors and manufacturing methods, which is applied in the field of electronic information, can solve problems such as increasing the cost of chip resistors, achieve the effects of increasing anti-sulfurization performance and reliability, reducing costs, and reducing process and material consumption

Inactive Publication Date: 2012-08-22
HUAWEI TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The terminal electrode and the back electrode are set on the substrate of the chip resistor, and the resistor body on the substrate is electrically connected to the back electrode through the terminal electrode, and the back electrode is used as the welding electrode. The terminal electrode and the back electrode set on the substrate increase The cost of chip resistors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip resistor and manufacturing method thereof and communication equipment
  • Chip resistor and manufacturing method thereof and communication equipment
  • Chip resistor and manufacturing method thereof and communication equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The first embodiment of the present invention provides a chip resistor, which can be used in high-speed transmission, high-density mounting, anti-vulcanization and high reliability, etc., as a surface mount resistor or IC built-in resistor, such as figure 2 As shown, the resistor includes:

[0029] A resistor 22 is attached to the substrate 21, and two protective layers (primary protective layer 25 and secondary protective layer 26) are sequentially covered on the outside of the resistor 22. The two ends of the resistor 22 are arranged on the same surface of the substrate. The surface electrodes 23 and 231 of the resistor are electrically connected. The surface electrodes 23 and 231 are all covered with surface electrode protection layers 24 and 241 that are electrically connected to the surface electrodes 23 and 231. The surface electrode protection layer 24 is covered with two layers of metal Layers 27 and 28, the other side of the electrode protection layer 241 is also ...

Embodiment 2

[0041] The second embodiment provides a method for manufacturing a chip resistor, which can be used to manufacture the resistor given in the first embodiment, and the method includes:

[0042] Fabricate a resistor and two surface electrodes on the panel of the substrate, the resistor is between the two surface electrodes, and both ends of the resistor are electrically connected to the surface electrodes;

[0043] A primary protective layer covering the resistor body and a secondary protective layer covering the primary protective layer are made on the resistor body, and the surface electrode protective layer covering the surface electrode is made with a conductive material outside the surface electrode, and Two metal layers are electroplated on the surface electrode protection layer, so that the surface electrode protection layer after the electroplating metal layer is used as a welding electrode.

[0044] Combine below Figure 8 Schematic, the process of making the resistor by the a...

Embodiment 3

[0058] This embodiment provides a communication device, which is a communication device applying the resistor given in the first embodiment, such as Picture 9 As shown, the communication device includes:

[0059] The housing 301 is a circuit board 302 arranged in the housing 301. The circuit board 302 is provided with electrical components 303 and chip resistors 304; the chip resistors adopt the respective ones given in the first embodiment. A structure of chip resistors. The communication device can be a router, a switch, a mobile terminal, a master computer, etc., and the invention is not limited by the specific type of the communication device. As long as the circuit board is used, and the communication device using the chip resistor on the circuit board is included in this Within the communication device defined in the embodiment of the invention.

[0060] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides a chip resistor and a manufacturing method thereof, and belongs to the technical field of electronic information. The resistor comprises that: a resistor body is attached to a substrate; two protective layers are coated outside the resistor body; surface electrodes which are in electrical conduction with the resistor body are arranged on the substrate at both ends of the resistor body; surface electrode protective layers which are in electrical conduction with the surface electrodes are coated outside the surface electrodes; and two metal layers are coated outside the surface electrode protective layers. The manufacturing method comprises the following steps of: manufacturing the resistor body and the two surface electrodes on panel of the substrate, wherein the resistor body is positioned between the two surface electrodes and both ends of the resistor body are respectively in electrical conduction with the surface electrodes; and manufacturing a primary protective layer covering the resistor body and a secondary protective layer covering the primary protective layer on the resistor body, and manufacturing the surface electrode protective layers covering the surface electrodes outside the surface electrodes by using conducting materials, and electroplating the two metal layers on the surface electrode protective layers to ensure that the surface electrode protective layers on which the metal layers are electroplated are used as welding electrodes. The chip resistor has the advantages of simple structure and low cost.

Description

Technical field [0001] The present invention relates to the field of electronic information technology, in particular to a chip resistor, a manufacturing method thereof, and communication equipment. Background technique [0002] As a common electronic component, the chip resistor has become one of the most widely used resistors. With the development of the electronic information industry, the requirements for high-density mounting, high transmission rate, and high reliability of electronic components continue to increase. To achieve these new functions in the traditional chip resistor structure, it is faced with structure and cost. As a result, the application of resistors in these new occasions is greatly restricted. [0003] Existing mainstream chip resistors, its typical structure is as figure 1 As shown, a resistor 2 is mounted on the front surface of the substrate 1, a primary protective layer 6 and a secondary protective layer 7 are provided on the resistor 2, and the two en...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/18H01C1/02H01C1/14H01C17/06H01C17/12H01C17/02H01C17/28H01C17/242
Inventor 代郁峰肖培义邓勇威
Owner HUAWEI TECH CO LTD