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Metallized polyimides film and flexible circuit board using the same

A technology of polyimide film and metal film, which is applied in the direction of circuit substrate materials, improvement of metal adhesion of insulating substrates, metal layered products, etc., can solve problems such as polyimide film peeling, and achieve high industrial value Effect

Active Publication Date: 2014-07-02
SUMITOMO METAL MINING CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, since the wire bonding of the inner lead portion of the wiring with a pitch of 25 μm is performed at 400° C. or higher under pressure, high heat and pressure are concentrated on the narrow tip of the inner lead. Next, there is a problem that the top end of the inner lead and the polyimide film peel off

Method used

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  • Metallized polyimides film and flexible circuit board using the same

Examples

Experimental program
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Effect test

Embodiment 1

[0102] First, use an oxygen transmission rate of 450cm 3 / (m 2 24 hours 1013hPa), water absorption rate is 1.8%, thermal expansion coefficient is 11ppm / ℃ in TD direction, and if figure 1 As shown in the X-ray diffraction results of the film shown, only a peak with a full width at half maximum of 1.0° was found at 2θ=14°, and a long polyimide film with a thickness of 35 μm mainly composed of biphenyltetracarboxylic acid (manufactured by Kaneka Co., Ltd. 35FP), using a sputtering device consisting of an uncoiler, a sputtering device, and a winding machine, on one side of the polyimide film, an average thickness of The chromium-nickel alloy layer of 20 mass % Cr is used as the metal film. Then, likewise, an average thickness of copper film.

[0103] Next, a copper layer having a thickness of 8 μm was formed on the copper film by electrolytic copper plating to obtain a metallized polyimide film. The electrolytic plating bath used was a copper sulfate plating bath with a cop...

Embodiment 2

[0107] A flexible wiring board was produced in the same manner as in Example 1 except that the metallized polyimide film obtained in Example 1 was used, and the wiring pitch was 25 μm, and the rate of poor bonding was obtained in the same manner as in Example 1. It can be seen that the bonding ratio of the inner lead and the polyimide film is 0.005%, and there is sufficient dimensional reliability even if a fine pitch is formed.

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Abstract

PURPOSE: A metalized polyimide film and flexible printed circuit board using the same are provided to have initial adhesiveness over 900N / m and have adhesive strength after PCT test over 600N / m. CONSTITUTION: A metal layer is directly formed on a surface of a polyimide film by plating method. The polyimide film has oxygen transmission approximately 300~500cm^2 / m^2 / 24h and absorption rate 1~3% under 1013 hPa when film thickness is 35 μm. The polyimide film has thermal expansion coefficient approximately 10ppm / °C~18ppm / °C. The polyimide film includes imide coupling among polyimide molecule by biphenyl tetracarbonic acid and diamine compound. When the TD direction of a surface is thin film X diffraction measured, a half width is less than 1.5° in 2Θ=12°~18°.

Description

technical field [0001] The present invention relates to a metallized polyimide film and a flexible circuit board obtained by using the film; more specifically, it relates to a metallized polyimide film having an initial adhesion strength of 900 N / m or more and after a PCT test, an adhesion strength of 600 N / m or more. A polyimide film, and a flexible circuit board obtained by using the film. Background technique [0002] The substrates that form electronic circuits and carry these electronic components include hard plate-like "rigid circuit boards" and film-shaped "flexible circuit boards" that are flexible and can be bent freely (hereinafter, sometimes referred to as "FPC"). ). In particular, FPC produces this kind of flexibility and can be used in parts that require flexibility, such as circuit boards for LCD drivers, hard disk drives (HDD), digital versatile disc (DVD) modules, and hinges of mobile phones. Demand is gradually increasing. [0003] However, such a flexib...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03H05K3/38B32B15/088B32B27/34
CPCB32B15/015B32B15/088B32B15/20H05K3/46
Inventor 曾根博文小笠原修一
Owner SUMITOMO METAL MINING CO LTD
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