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Plating structure and method for manufacturing electric material

A coating and structure technology, applied in chemical instruments and methods, circuits, thin material processing, etc., can solve the problems of reduced reflectivity, increased contact resistance, loss of silver luster and reflective performance, etc. The effect of low resistance

Active Publication Date: 2011-01-26
KANZACC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, silver plating has the following problems: in an environment containing sulfur, it will be vulcanized with time or increased in temperature, and the reflectance will decrease
[0012] At this time, if the tin or tin alloy layer becomes thicker, there will be a problem that the contact resistance will increase
In addition, the reflectivity is also reduced, and the original luster and reflective properties of silver are lost.
[0013] Alternatively, an organic film is also formed on the surface of silver to prevent sulfidation, but the organic film lacks heat resistance, and there is a problem with sulfidation resistance at high temperatures

Method used

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  • Plating structure and method for manufacturing electric material
  • Plating structure and method for manufacturing electric material
  • Plating structure and method for manufacturing electric material

Examples

Experimental program
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Effect test

experiment example

[0081] basic sample

[0082] As a substance corresponding to the plating substrate 102 in FIG. 1 , a 1 cm square sheet of a copper alloy strip for lead frame (manufactured by Furukawa Electric Co., Ltd.: product name EFTEC3) was used. One surface of this sheet was plated with a 1 μm copper substrate, and then plated with 2 μm thick silver, which was used as a basic sample, and the basic sample was tin-plated and heat-treated according to the following experimental standards.

[0083] Experimental sample standard

[0084] L-1: Blank (in the state of the basic sample)

[0085] L-2: A tin layer with a thickness of 0.01 μm was formed on the silver surface of the basic sample by thin plating.

[0086] L-3: After forming a tin layer with a thickness of 0.01 μm on the silver surface of the basic sample by thin plating, the sample was heat-treated at 300° C. for 10 seconds.

[0087] L-4: A tin layer with a thickness of 0.02 μm was formed on the silver surface of the basic sampl...

Embodiment 1

[0131] right figure 2 The frame shown in the shape of the substrate 203 is silver plated and tin plated. A copper alloy strip for a lead frame (manufactured by Furukawa Electric Co., Ltd.: EFTEC3) was used as a material for the frame of the base, and was formed by punching. After the degreasing treatment, the frame was acid-washed with 5% sulfuric acid, and the copper substrate was plated with a lustrous copper sulfate bath (copper sulfate 200g / L, sulfuric acid 50g / L, commercially available brightener 2mL / L). The film thickness of the base copper plating was 1.0 μm. Next, bright silver plating with a film thickness of 2 μm was performed using a glossy silver cyanide bath (35 g / L of silver cyanide, 90 g / L of potassium cyanide, and 10 g / L of potassium carbonate). Furthermore, tin with a film thickness of 0.01 μm was plated with an alkanolsulfonic acid bath (18 g / L of stannous, 100 g / L of free acid, and 10 mL / L of semi-brightener), followed by heat treatment at 250° C. for 10 ...

Embodiment 2

[0133] A stainless steel (SUS 304) plate with a thickness of 1 mm and a square of 1 cm is used as a substrate, and after degreasing treatment, it is acid-washed with 5% sulfuric acid, and a glossy copper sulfate bath (copper sulfate 200g / L, sulfuric acid 50g / L, commercially available brightener 2mL) / L) plated copper substrate. The film thickness of the base copper plating was 1.0 μm. Next, bright silver plating with a film thickness of 2 μm was performed using a glossy silver cyanide bath (35 g / L of silver cyanide, 90 g / L of potassium cyanide, and 10 g / L of potassium carbonate). Furthermore, tin with a film thickness of 0.01 μm was plated with an alkanolsulfonic acid bath (18 g / L stannous, 100 g / L free acid, 10 mL / L semi-brightener), and then heat-treated at 500° C. for 10 seconds to obtain a glossy plate . The vulcanization test was carried out, and the same result as L-3 in Table 1 was obtained.

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Abstract

There is provided a plating structure obtained by heat-treating a silver-plated structure obtained by forming a tin-plated layer, an indium-plated layer, or a zinc-plated layer, having a thickness of 0.001 to 0.1 mum, on a surface of the silver-plated layer formed on a surface of a plating base. There is also provided a coating method for obtaining the plating structure which comprises the step of melting a particle deposit spottedly deposited at 210-6 to 810-6 g / cm2 such that the spot-deposited particles have gaps therebetween as viewed above and the particles each having an average diameter of 20 to 80 nm do not pile up in a direction perpendicular to the surface of the silver layer to obtain a film.

Description

technical field [0001] The present invention relates to a plated structure in which degradation of surface properties is improved, in particular, a plated structure of a material for electrical components that requires prevention of sulfidation, and a method for manufacturing the material for electrical components having the plated structure. Specifically, it relates to plating of electrical contact materials such as metal lead frames or leads using metal strips, leads provided on non-conductive substrates such as ceramics, leads, reflectors or terminals, connectors, and switches. Covering structure and method of manufacturing the material. In more detail, it is related with the plating structure of the material for electrical components excellent in sulfuration resistance, and its manufacturing method. In particular, the present invention relates to a plated structure of an electrical material having excellent sulfur resistance, low contact resistance, or high surface reflec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/48H01L33/60
CPCC25D5/50C22F1/16C22F1/14B32B15/01C25D7/12H01L33/62C25D5/10H01L33/60H01L2224/48091H01L2224/48247Y10T428/12681Y10T428/12715Y10T428/12792C25D5/627C25D7/123H01L2924/00014C25D7/00
Inventor 墨谷义则杉江欣也
Owner KANZACC
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