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Plating solution formulation for plating black chrome on oxygen-free copper matrix and electroplating method

An oxygen-free copper and substrate technology, which is applied in the field of black chrome plating on the surface of oxygen-free copper and metal surface treatment, can solve the problems affecting the interaction between microwave and electron beam, and achieve the effect of reducing the impact and enhancing the absorption

Inactive Publication Date: 2011-04-06
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the high-power coupling cavity traveling wave tube, when the electrons exchanged energy through the slow wave part enter the collector part, there is no focusing effect of the periodic magnetic field, the electron beam begins to diverge, and the stray high-energy electrons bombard the entrance of the collector core , causing the secondary emission of electrons, which affects the interaction between microwave and electron beam after returning to the coupling cavity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Preparation of black chromium plating bath: take by weighing chromic anhydride (analytical pure) and potassium fluorosilicate (analytical pure) according to the formula, pour into about 1 / 4 volume of deionized water for dissolving, then add the remaining volume of deionized water, Add the nitric acid (analytical pure) of ratio ratio finally. The components of the plating solution are: chromic anhydride 280g / l; potassium fluorosilicate 8g / l; nitric acid 2g / l.

[0017] Preparation of mixed pickling solution: measure nitric acid and sulfuric acid in formula quantity, slowly add sulfuric acid into nitric acid and keep stirring, finally add sodium chloride in formula quantity, stir and make it dissolve. The proportion of mixed acid is nitric acid: 500ml / l; sulfuric acid: 500ml / l; sodium chloride: 5g / l.

[0018] First use 80-mesh quartz sand to sandblast the surface of the oxygen-free copper substrate. Then bind the oxygen-free copper substrate with copper wires, fully degr...

Embodiment 2

[0022] Preparation of black chromium plating bath: take by weighing chromic anhydride (analytical pure) and potassium fluorosilicate (analytical pure) according to the formula, pour into about 1 / 4 volume of deionized water for dissolving, then add the remaining volume of deionized water, Add the nitric acid (analytical pure) of ratio ratio finally. The components of the plating solution are: chromic anhydride 300g / l; potassium fluorosilicate 10g / l; nitric acid 2g / l.

[0023] Preparation of mixed pickling solution: measure nitric acid and sulfuric acid in formula quantity, slowly add sulfuric acid into nitric acid and keep stirring, finally add sodium chloride in formula quantity, stir and dissolve. The proportion of mixed acid is nitric acid: 500ml / l; sulfuric acid: 500ml / l; sodium chloride: 10g / L.

[0024] First use 100-mesh quartz sand to sandblast the surface of the oxygen-free copper substrate. Then bind the oxygen-free copper substrate with copper wires, fully degrease ...

Embodiment 3

[0028] Preparation of black chromium plating bath: take by weighing chromic anhydride (analytical pure) and potassium fluorosilicate (analytical pure) according to the formula, pour into about 1 / 4 volume of deionized water for dissolving, then add the remaining volume of deionized water, Add the nitric acid (analytical pure) of ratio ratio finally. The components of the plating solution are: chromic anhydride 290g / l; potassium fluorosilicate 9g / l; nitric acid 2g / l.

[0029] Preparation of mixed pickling solution: measure nitric acid and sulfuric acid in formula quantity, slowly add sulfuric acid into nitric acid and keep stirring, finally add sodium chloride in formula quantity, stir and dissolve. The proportion of mixed acid is nitric acid: 500ml / l; sulfuric acid: 500ml / l; sodium chloride: 8g / L.

[0030] First use 90-mesh quartz sand to sandblast the surface of the oxygen-free copper substrate. Then bind the oxygen-free copper substrate with copper wires, fully degrease the...

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Abstract

The invention discloses a plating solution formulation for plating black chrome on an oxygen-free copper matrix and an electroplating method. The plating solution formulation comprises 280-300 g / l of chromic anhydride, 8-10 g / l of potassium fluosilicate and 2 g / l of nitric acid. The electroplating method comprises steps of sand blasting, deoiling, acid cleaning, black chrome plating and thermal treatment in a vacuum furnace. The invention has the advantages that after one layer of uniform and compact black chrome with strong adhesion force is plated on the surface of the oxygen-free copper matrix, the absorption of a collector on electrons after energy conversion is enhanced, and the influence of secondarily emitted electrons on the mutual effect of slow wave components is reduced.

Description

【Technical field】 [0001] The invention belongs to the technical field of metal surface treatment, in particular to the technical field of black chrome plating on the surface of oxygen-free copper. 【Background technique】 [0002] Due to the development of microwave vacuum device applications, there is an urgent need for high-quality, high-performance microwave devices. In the high-power coupling cavity traveling wave tube, when the electrons exchanged energy through the slow wave part enter the collector part, there is no focusing effect of the periodic magnetic field, the electron beam begins to diverge, and the stray high-energy electrons bombard the entrance of the collector core , resulting in the secondary emission of electrons, which affects the interaction between the microwave and the electron beam after returning to the coupling cavity. 【Content of invention】 [0003] One of the technical problems to be solved by the present invention is to provide a plating solut...

Claims

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Application Information

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IPC IPC(8): C25D3/08C25D5/50
Inventor 吴华夏方卫肖兵李锐李康伟马宁宁夏明
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE