Diamond wire cutting apparatus and process of silicon wafer for solar cell
A technology of solar cells and cutting equipment, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve problems such as environmental pollution, low processing efficiency, large surface damage layer of silicon wafers, etc., to eliminate environmental pollution and improve The effect of processing quality and large output advantages
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[0020] In order to understand the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and embodiments:
[0021] Such as Figure 1 to Figure 3 As shown in the diamond wire cutting equipment for silicon wafers for solar cells, the guide wheel part includes two main sheaves 1, and a small sheave 2 with a diameter smaller than that of the main sheave 1 is added between the two main sheaves 1 to make the small The outer diameter tangent to the upper end of the groove of the sheave 2 coincides with the outer diameter tangent of the upper end of the groove of the two main cutting sheaves 1, and the installation is kept at the same horizontal position. The groove shape of the small sheave 2 is the groove of the two main cutting sheaves 1 The shape is the same, the distance from the vertical line of the center of the small sheave 2 to the center of the two main sheaves is equal. The small sheave 2 is used as a g...
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