Method for adjusting wafer levels of acoustic coupling resonance filter

Abstract

The invention relates to a method for adjusting wafer levels of an acoustic coupling resonance filter. The method comprises the following steps of: providing a substrate of which the partial inside or upper surface is provided with a sacrificial layer; forming a first resonator of a first stack area on the partial sacrificial layer of the substrate; forming a first resonator of a second stack area on the substrate; separating the first resonator of the first stack area from the first resonator of the second stack area; forming an air chamber below the second stack area; measuring the second stack area for the first time; adjusting top electrodes of the first resonator of the first stack area according to the first-time measurement; forming a decoupling layer on the first resonator of the first stack area and the first resonator of the second stack area respectively; forming a second resonator on the decoupling layers of the first stack area and the second stack area respectively; measuring the first stack area or the second stack area for the second time; and adjusting top electrodes of the second resonator of the first stack area according to the result of the second-time measurement so as to realize ideal device performance. By the method, process cross or pollution caused by a release process of the first resonators is reduced to the greatest extent.

Description

technical field [0001] The invention relates to an acoustic coupling device. More particularly, it relates to a method for wafer-level adjustment of an acoustic coupling resonator filter that applies a correction adjustment process to improve the processing yield of an acoustic coupling device that achieves expected performance. Background technique [0002] Radio frequency (RF) filters are critical components in any wireless communication system, and as these systems continue to miniaturize, pressure is on filter manufacturers to further reduce filter size without changing device performance. Every day. Handheld device system manufacturers are keenly interested in filter technologies that promise low cost and small size. As the variety of power-hungry applications continues to increase in handheld communication devices, low insertion loss filters are becoming very important to prolong talk time and battery life. Bulk wave (BAW) resonators are known for their high quality...

AI Technical Summary

Problems solved by technology

Based on the processing accuracy of thin film deposition technology (standard deviation of 0.5% film thickness), if only relying on the uniformity of the deposition process itself, it is currently impossible to manufacture CRF with suitable processing yield

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