Plastic product and preparation method thereof
A technology for plastic products and plastics, applied in thin material processing, superimposed layer plating, metal material coating process and other directions, can solve the complex metallization process of plastic surface, high energy requirements, poor adhesion between coating and plastic substrate and other problems, to achieve the effect of low cost, low energy requirement and simple process
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[0012] The invention provides a kind of preparation method of plastic product, comprises the following steps:
[0013] 1) Forming a plastic substrate; the plastic substrate is a thermoplastic or thermosetting plastic containing an electroless plating accelerator, and the electroless plating accelerator is evenly distributed in the thermoplastic or thermosetting plastic; the electroless plating accelerator is a general formula ABO 3 A perovskite structure compound, wherein A contains at least one of the elements in the 9th, 10th, and 11th columns of the periodic table, and A selectively contains one or more of the IA, IIA group elements, and lanthanide elements; B One or more of the group IVB and VB elements;
[0014] 2) Laser vaporizes the surface of the plastic substrate, exposing the electroless plating accelerator;
[0015] 3) Electroless copper or electroless nickel plating is performed on the surface of the electroless plating accelerator in step 2), and at least one ele...
Embodiment 1
[0047] (1) CaCu 3 Ti 4 o 12 Put it into a high-speed ball mill and mill it for 10 hours until the average particle size of the powder is 700nm; mix PPE / PPS resin alloy, CaCu 3 Ti 4 o 12 , Calcium silicate fiber and antioxidant 1010, according to the mass ratio of 100:10:30:0.2, mixed with a high-speed mixer, extruded and granulated with a twin-screw extruder (Nanjing Rubber and Plastic Machinery Factory), and then injection molded into LED Lamp circuit board carrier.
[0048] (2) Use an infrared laser (Tide, DPF-M12) to print metal circuit patterns on the LED lamp circuit board carrier. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm, delay 30μs, frequency 40KHz , power 3W, filling pitch 50 μm; after the laser irradiation is completed, the surface of the plastic carrier is ultrasonically cleaned.
[0049] (3) Immerse in the chemical nickel plating solution for 10 minutes to form a nickel layer with a thickness of 3 μm; immerse in the c...
Embodiment 2
[0052] Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:
[0053] In step (1), the CuNiTi 2 o 6 Ball milled to an average particle size of 800nm and dried; PEEK resin, CuNiTi 2 o 6 , glass fiber and antioxidant 168 are mixed according to the mass ratio of 100:20:30:0.2, extruded and granulated, and then injection molded into the electronic connector housing of the automobile engine;
[0054] In step (3), the sequence of electroless plating is: first electroless nickel plating for 8 minutes to form a 2 μm thick nickel layer, then electroless copper plating for 3 hours to form a 13 μm thick copper layer, and then electroless nickel plating for 10 minutes to form a 3 μm thick nickel layer, Finally, a gold layer with a thickness of 0.03 μm is flash-plated.
[0055] Through the above steps, the plastic product used as the housing of the electronic connector of the automobile engine in this embodiment is obtai...
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Abstract
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