Semi-solid deposition pressure welding device for dissimilar metals

A technology of pressure welding and dissimilar metals, applied in welding equipment, metal processing equipment, non-electric welding equipment, etc., can solve the problems of metallurgical incompatibility, residual stress, large difference in mechanical properties, etc., and achieve flexible temperature adjustment and rapid heating , cheap effect

Active Publication Date: 2011-06-01
NANJING UNIV OF SCI & TECH
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  • Abstract
  • Description
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Problems solved by technology

Due to the poor flexibility of the friction stir welding process, while the diffusion welding needs to be carried out in a vacuum chamber and the efficiency is relatively low, these solid phase connections are limited in actual production applications
However, when conventional fusion welding methods such as TIG welding and MIG welding are used for welding dissimilar metals, the followin...

Method used

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  • Semi-solid deposition pressure welding device for dissimilar metals
  • Semi-solid deposition pressure welding device for dissimilar metals
  • Semi-solid deposition pressure welding device for dissimilar metals

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Embodiment Construction

[0009] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0010] combine figure 1 , figure 2 The invention discloses a dissimilar metal semi-solid cladding pressure welding device, which comprises a pressure control device, a temperature control device, a gas protection device and a die device, the pressure control device is connected with the die device, and the pressure control device controls the pressure Passed to the compression molding device, the compression molding device exerts pressure on the welding sample; the temperature control device is connected to the compression molding device, and the temperature control signal adjusts the magnitude and on-off of the current of the induction heating coil 21, and controls the heating process of the compression molding device; The protection device is connected with the compression molding device, and the protection gas is input into the compression molding device...

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Abstract

The invention relates to a semi-solid deposition pressure welding device for dissimilar metals. The device comprises a pressure control device, a temperature control device, a gas protection device and a die assembly, wherein the pressure control device is connected with the die assembly and transfers pressure to the die assembly; a heating coil in the temperature control device is arranged outside the die assembly; a temperature control signal is used for regulating and inducing the magnitude and on/off of the current of the heating coil so as to control the heating process of the die assembly; and the gas protection device is connected with the die assembly and inputs protection gas into the die device. The semi-solid deposition pressure welding device for dissimilar metals provided by the invention is easy to operate and has the advantages of simple structure, excellent welding effect and good market prospect.

Description

technical field [0001] The invention belongs to a welding device, in particular to a semi-solid cladding pressure welding device for aluminum alloy and other dissimilar metals. Background technique [0002] The dissimilar metal connection structure has the excellent performance of the combination of the two materials, and has been widely used in the fields of national defense and national production, and its application prospects continue to expand. However, due to the huge differences in the physical, chemical and mechanical properties of dissimilar metals, the requirements for the connection method are relatively strict. At present, mechanical connection, adhesive bonding, welding and other methods are generally used, mainly mechanical connection and adhesive bonding or a combination of the two. However, there are many disadvantages in mechanical connection and adhesive bonding, such as low strength, large structural quality, and redundant objects during bonding. questio...

Claims

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Application Information

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IPC IPC(8): B23K20/02B23K20/26
Inventor 王克鸿尚晶周琦张德库葛佳琪周晓晓蒋勇
Owner NANJING UNIV OF SCI & TECH
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