Diamond-filled isotropical high-performance heat-conductive adhesive and preparation method thereof

Abstract

The invention belongs to the technical field of material preparation, in particular relates to a diamond-filled isotropical high-performance heat-conductive adhesive and a preparation method thereof. The preparation method comprises the following steps of: firstly, mixing epoxy resins with an epoxy toughness modifier by mechanical stirring for 20 minutes at the rate of 1,500 r / min; secondly, adding a heat-conductive diamond filler into the obtained product under the stirring state, adding a modifier and a diluent on the filler surface, and continuously stirring for 15 minutes after the addition process is over; thirdly, adding a curing agent and a curing accelerator into the mixture after uniform mixing, performing mechanical stirring for 5 minutes, and transferring the mixture into a high-speed shear mixing machine for mixing for 30 seconds at the rate of 2,000 r / min; and fourthly, obtaining uniformly mixed jelly, namely the heat-conductive adhesive, after performing repeated mixing for three times in the high-speed shear mixing machine. The heat-conductive adhesive prepared by the method provided by the invention has higher heat conductivity of 10-16w / (m.k), and the shear strength of the adhesive can be improved.

Description

technical field [0001] The invention belongs to the technical field of material preparation, in particular to a diamond-filled isotropic high-performance heat-conducting adhesive and a preparation method thereof. Background technique [0002] With the development of large-scale integrated circuits and packaging technology, heat dissipation and thermal stress are key issues in many microelectronics and optoelectronic packaging applications. The failure of electronic components directly affects the life and reliability of various high-precision equipment using them; traditional heat dissipation materials such as metals and ceramics have the characteristics of large specificity, difficult processing, poor electrical insulation, difficult processing and molding, and cannot The shortcomings of different shapes of thermally conductive interfaces limit its application in specific fields. Due to the low thermal conductivity and poor thermal conductivity of the adhesive itself, how t...

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Problems solved by technology

[0002] With the development of large-scale integrated circuits and packaging technology, heat dissipation and thermal stress are key issues in many microelectronics and optoelectronic packaging applications. The failure of electronic components directly affects the life and reliability of various high-precision equipment using them; traditional heat dissipation materials such as metals and ceramics have the characteristics of large specificity, difficult processing, poor electrical insulation, difficult processing and molding, and cannot The shortcomings of different shapes of thermally conductive interfaces limit its application in specific fields. Due to the low thermal conductivity and poor thermal conductivity of the adhesive itself, how to improve the high thermal conductivity of the adhesive has attracted more and more attention.

[0003] Key requirements for electronic and optoelectronic thermal control materials: (1) High thermal conductivity; (2) Minimize thermal stress that affects reliability and CTE (similar to ceramics, semiconductor silicon, etc., which are widely used in electrical insulators), ceramics And the CTE range of semiconductors is 2-7ppm / K, copper has a high conductivity (400W / m.K), but its CTE is 17ppm / K, which will cause problems related to thermal stress, such as solder joint damage and deformation, aluminum Alloys have half the thermal conductivity of copper and have a higher CTE. Traditional low CTE materials dating back to the mid-20th century have higher densities and thermal conductivity, but not higher than aluminum. Diamond has a lower CTE and has high thermal conductivity. Better than copper and tungsten, and lower density

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