Ceramic coating comprising yttrium which is resistant to a reducing plasma

A ceramic coating, plasma technology, applied in coating, metal material coating process, thin material processing and other directions

Active Publication Date: 2014-07-09
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] Particles are known to be a problem during semiconductor component processing in highly corrosive plasma environments

Method used

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  • Ceramic coating comprising yttrium which is resistant to a reducing plasma
  • Ceramic coating comprising yttrium which is resistant to a reducing plasma
  • Ceramic coating comprising yttrium which is resistant to a reducing plasma

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Embodiment Construction

[0034] Before formally entering the detailed description, it should be pointed out that in this specification and the claims, the singular forms "a", "an" and "the" include plural referents thereof unless the context clearly dictates otherwise.

[0035] As used herein, when the word "about" is used, it means that the stated numerical value is accurate to within ±10%.

[0036] To aid understanding, the same reference numbers have been used wherever possible to refer to the same elements across the various views. It is contemplated that elements and features of one embodiment may be incorporated into other embodiments without further elaboration. It should also be noted that the accompanying drawings are intended to illustrate only specific embodiments of the invention, where the drawings will be particularly helpful in understanding the embodiments of the invention. Not all specific embodiments require the accompanying drawings to understand and are therefore not to be conside...

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Abstract

Particulate generation is often a problem with semiconductor component processing in a highly corrosive plasma environment. This problem is more serious when the above-mentioned plasma is reducing plasma. Experimental data shows that when forming a plasma-sprayed yttrium-containing ceramic (such as yttrium oxide, Y2O3-ZrO2 solid solution, YAG and YF3), when the average effective particle size range of the powder feed for spraying ceramics is between about 22 μm to about 0.1 μm provides a low porosity coating with a smooth and compact surface. These sprayed materials reduce particle generation in corrosive reducing plasma environments.

Description

[0001] This application is related to two other applications related to semiconductor processing components using sprayed yttrium-containing ceramic materials. The sprayed yttrium-containing ceramic materials described above can generally be applied to aluminum or aluminum alloy substrates. The above related application is US Patent Application 10 / 075,967 to Sun et al., filed February 14, 2002, and entitled "Yttrium Oxide Based Surface Coating For Semiconductor IC Processing Vacuum Chamber," filed August 2004. U.S. Patent No. 6,776,873, issued July 17; and U.S. Patent Application No. 10 / 898,113 to Sun et al., filed July 22, 2004, entitled "Clean Dense Yttrium Oxide Containing Protecting Semiconductor Apparatus," filed at It was published on February 17, 2005, and the publication number is US 2005 / 0037193A1, which is still under review. The subject matter of the above-cited patents and applications is hereby incorporated by reference into the present specification. technical f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C4/10C23C4/12
CPCY10T428/24355C23C4/105Y10T428/24997C23C4/11
Inventor 詹尼弗·Y·孙贺小明肯尼思·S·柯林斯托马斯·格瑞斯赛恩·撒奇元洁徐理段仁官
Owner APPLIED MATERIALS INC
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