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Ultra low melt metal nanoparticle composition and method of forming conductive features by using the same

A technology of metal nanoparticles and conductive components, which is applied in the field of manufacturing conductive components, can solve the problems of dimensional stability and the intolerance of plastic substrates, etc.

Inactive Publication Date: 2015-04-08
XEROX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although some specialty plastic substrates can tolerate annealing temperatures of 250°C, most plastic substrates cannot tolerate such temperatures, so dimensional stability remains an issue

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] 20 grams of silver acetate and 112 grams of dodecylamine were added to a 1 liter reaction flask. The mixture was heated at 65°C and stirred for about 10 to 20 minutes until the dodecylamine and silver acetate were dissolved. 7.12 g of phenylhydrazine was added dropwise to the above liquid at 55°C with vigorous stirring. The color of the liquid changed from clear to dark brown, indicating the formation of silver nanoparticles. The mixture was stirred at 55°C for an additional hour and then cooled to 40°C. After the temperature had reached 40°C, 480 ml of methanol were added and the resulting mixture was stirred for about 10 minutes. The precipitate was filtered and rinsed briefly with methanol. The precipitate was dried under vacuum at room temperature overnight, resulting in 14.3 grams of silver nanoparticles having a silver content of 86.6% by weight.

Embodiment 2

[0078] Dissolve 0.04 g of polystyrene in 1.4 g of toluene. After the polystyrene was completely dissolved, 2 grams of silver nanoparticles (58% by weight) of Example 1 were added to the solution with thorough stirring. The prepared compositions were spin-coated onto two glass slides at varying spin rates. The coated films on the two glass slides were heated in an oven at 130° C. for 30 minutes to form mirror-like films with thicknesses of 1.4 μm and 3.2 μm, respectively. The conductivity of the annealed film was 3.74×10 4 S / cm (thickness 1.4 microns) and 2.31×10 4 S / cm (thickness 3.2 microns), the conductivity was measured using a conventional four-probe technique. The coating solution of silver nanoparticles was stable at room temperature for more than 7 days without precipitation.

Embodiment 3

[0080] Dissolve 0.08 g of polystyrene in 1.4 g of toluene. After the polystyrene was completely dissolved, 2 grams of silver nanoparticles (57% by weight) of Example 1 were added to the solution. The prepared compositions were spin-coated onto two glass slides at varying spin rates. The coated films on the two glass slides were heated in an oven at 130° C. for 30 minutes to form mirror-like films with thicknesses of 7.2 μm and 15.3 μm, respectively. The conductivity of the annealed film was 3.74×10 3 S / cm (thickness 7.2 microns) and 1.14×10 3 S / cm (thickness 15.3 microns), the conductivity was measured using a conventional four-probe technique. The coating solution of silver nanoparticles was stable at room temperature for more than 7 days without precipitation.

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Abstract

A method of forming conductive features on a substrate, the method includes reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent, and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles. After isolating the plurality of metal nanoparticles, a liquid composition that includes a polymeric binder, a liquid and the plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles is deposited on a substrate by a liquid deposition technique to form a deposited composition. The deposited composition is then heated to form conductive features on the substrate.

Description

technical field [0001] The present disclosure generally relates to methods of making conductive components, and more particularly, to methods of making conductive components using liquid deposition techniques and liquid compositions used. Background technique [0002] Fabrication of circuit components using liquid deposition techniques is of great interest because these techniques offer a low-cost alternative to conventional mainstream amorphous silicon technologies for electronic applications such as thin-film transistors (TFTs), light-emitting diodes ( LED), RFID tags, photoelectric technology, etc. However, the deposition and / or patterning of functional electrodes, pixel pads, and conductive traces, lines, and tracks that meet the conductivity, processing, and cost requirements of practical applications has become a great challenge. Silver is of particular interest as a conductive element for electronic devices because it is much lower cost than gold and has much better ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/00H01B1/22H01B5/14B22F9/24B22F1/00B22F1/0545B22F1/107
CPCH05K2203/122H01B1/22H05K1/095H05K2201/0224B22F1/0074H05K1/097B22F1/0022B82Y30/00B22F1/0545B22F1/107B22F1/00
Inventor 柳平吴贻良A·维格勒斯沃斯胡南星
Owner XEROX CORP