High-strength high-conductivity copper alloy and preparation method thereof
A copper alloy, high-conductivity technology, applied in the direction of metal material coating process, coating, solid-state diffusion coating, etc., to achieve excellent electrical conductivity, high hardness, and the effect of improving hardness and wear resistance
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Embodiment 1
[0027] A pure copper substrate with a thickness of 5mm and a surface size of 50 mm×30 mm. Laser strengthening is performed on the surface. The process steps are as follows:
[0028] (1) Surface treatment of the substrate: first polish the surface of the pure copper substrate with No. 400 sandpaper, and then clean it with acetone;
[0029] (2) Powder pre-coating: use methyl fiber acetone solution as a binder to apply nickel-based alloy powder (the composition is Cr: 16%, Fe: 8-10%, Si: 3.5-5.5%, B: 3- 4.5%, C: 0.8-1%, Ni: Bal, particle size 45-100μm, the same below) pre-coated on the surface of the sample with a thickness of 0.9 mm, and dried in an oven at 100°C.
[0030] (3) Laser surface strengthening treatment: The specific process parameters are: spot diameter 5mm, laser power 2.2 kW, scanning speed 2mm / s, multi-channel overlap rate 40%.
[0031] (4) Leveling the laser-strengthened sample.
Embodiment 2
[0033] A pure copper substrate with a thickness of 5mm and a surface size of 50 mm×30 mm. Laser strengthening is performed on the surface. The process steps are as follows:
[0034] (1) Surface treatment of the substrate: first polish the surface of the pure copper substrate with No. 400 sandpaper, and then clean it with acetone;
[0035] (2) Powder pre-coating: Pre-coating nickel-based alloy powder on the surface of the sample with a methyl fiber acetone binder, with a thickness of 0.9 mm, and put it in an oven at 100°C to dry.
[0036] (3) Laser surface strengthening treatment: The specific process parameters are: spot diameter 5mm, laser power 2.2 kW, scanning speed 3mm / s, multi-channel overlap rate 40%.
[0037] (4) Leveling the laser-strengthened sample.
Embodiment 3
[0039] A pure copper substrate with a thickness of 5mm and a surface size of 50 mm×30 mm. Laser strengthening is performed on the surface. The process steps are as follows:
[0040] (1) Surface treatment of the substrate: first polish the surface of the pure copper substrate with No. 400 sandpaper, and then clean it with acetone;
[0041] (2) Powder pre-coating: Pre-coating nickel-based alloy powder on the surface of the sample with a methyl fiber acetone binder, with a thickness of 0.9 mm, and put it in an oven at 100°C to dry.
[0042] (3) Laser surface strengthening treatment: The specific process parameters are: spot diameter 5mm, laser power 2.2 kW, scanning speed 4mm / s, multi-channel overlap rate 40%.
[0043] (4) Leveling the laser-strengthened sample.
[0044] figure 1 For the prepared SEM photo of the middle part of the strengthened layer of the copper alloy, the microstructure of the strengthened layer of the alloy is given; figure 2 In order to prepare the XRD pattern of...
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