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Method for preparing bi-component polyurethane pouring sealant and product thereof

A two-component polyurethane and potting adhesive technology, applied in the field of polyurethane, can solve problems such as poor insulation performance and potting restrictions, and achieve the effects of fast curing speed at low temperature, easy control of conditions, and low viscosity

Active Publication Date: 2013-12-11
DONGGUAN HONGDA POLYUREFHANE RESIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the poor insulation performance of the invented product, the potting of electrical components is limited.

Method used

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  • Method for preparing bi-component polyurethane pouring sealant and product thereof
  • Method for preparing bi-component polyurethane pouring sealant and product thereof
  • Method for preparing bi-component polyurethane pouring sealant and product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment provides a method for preparing a two-component polyurethane encapsulant, comprising the following steps:

[0032] 1. Preparation of component A:

[0033] (1) add 40.0 grams of castor oil, 60.0 grams of polyoxypropylene triol (M=3000) in a dry and clean three-necked flask equipped with a thermometer, a stirring device, and a condenser, and vacuum dehydrate at 110° C. for two hours;

[0034] (2) Add 9.0 grams of flame retardant tris(2-chloropropyl) phosphate, 1.5 grams of EFKA defoamer 2720 (Ciba Efka defoamer 2720), and 1.5 grams of dibutyltin dilaurate when the temperature is lowered below 60 °C , get A component;

[0035] 2. Preparation of component B:

[0036] (1) Add 75.0 grams of polyoxypropylene triol (M=3000) in a dry and clean three-necked flask equipped with a thermometer, a stirring device, and a condenser, and 25.0 grams of polyoxypropylene diol (M=2000) at 110° C. vacuum dehydration for two hours,

[0037] (2) Add 0.6 g of antioxidant 264...

Embodiment 2

[0041] This embodiment is basically the same as Embodiment 1, and the difference is that the composition and weight of raw materials of component A and component B are different, as shown in the following table.

[0042] The raw material composition of embodiment 1 and embodiment 2

[0043]

[0044]

Embodiment 3

[0046] The steps of the preparation method of this implementation two-component polyurethane potting glue are as follows:

[0047] Preparation of component A: Add 42.00 grams of castor oil and 60.00 grams of polyoxypropylene triol (M=3000) into a dry and clean three-necked flask equipped with a thermometer, a stirring device, and a condenser, and vacuum dehydrate at 110°C for two hours Add 6.00 grams of flame retardant tris(2-chloropropyl) phosphate, 2.00 grams of EFKA defoamer 2720, 2.00 grams of dibutyltin dilaurate, and 1.00 grams of dibutyl phthalate to obtain A components.

[0048] Preparation of component B: Add 200.0 grams of polyoxypropylene triol to a dry and clean three-neck flask equipped with a thermometer, stirring device, and condenser, vacuum dehydrate at 110°C for two hours, and add 0.80 grams of antioxidant when the temperature is lowered to 60°C 264 and 0.70 g of antioxidant 1010. Nitrogen for protection, then add 147.00 g of toluene diisocyanate, add 3.0 g...

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Abstract

The invention relates to a bi-component polyurethane pouring sealant and a preparation method thereof. The polyurethane pouring sealant consists of a component A and a component B, wherein the component A is a hydroxyl end group component, and the component B is NCO-terminated polyurethane prepolymer prepared by reacting a hydroxyl compound with isocyanate. In the using process, the component A and the component B are mixed in a certain ratio. The prepared bi-component polyurethane pouring sealant is suitable for encapsulating medium and small electronic elements, such as encapsulation of circuit controllers of home appliances such as igniters and sensors, moistureproof and shockproof sealing of electronic and electric switches and sealed optical instruments of electronic elements, and the like; and the bi-component polyurethane pouring sealant does not contain any solvent, is adjustable in drying speed, can be cured at normal temperature or low temperature and stored stably, and has the advantages of good adhesion, flexibility, water resistance, flame retardancy, electric property and the like.

Description

technical field [0001] The invention relates to the technical field of polyurethane, in particular to a preparation method of a two-component polyurethane potting glue and a product thereof. Background technique [0002] Potting glue, also known as electronic glue, is used for bonding, sealing, potting and coating protection of electronic components. Potting is an important area of ​​polyurethane application. Potting is to mechanically or manually pour the liquid polyurethane compound into the device with electronic components and circuits, and solidify it into a thermosetting polymer insulating material with excellent performance under normal temperature or heating conditions. Its function is to strengthen the integrity of electronic devices, improve the resistance to external shocks and vibrations; improve the insulation between internal components and lines, which is conducive to the miniaturization and lightweight of devices; avoid direct exposure of components and line...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/08C09J175/14C09K3/10C08G18/67C08G18/66C08G18/48
Inventor 刘云发王瑞宏
Owner DONGGUAN HONGDA POLYUREFHANE RESIN
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