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White light-emitting diode (LED) manufacturing method

A production method and white light technology, applied in the field of lighting, can solve problems such as yellow circles and poor consistency, and achieve the effects of overcoming poor consistency, easy miniaturization, and good heat dissipation

Inactive Publication Date: 2011-07-27
中外合资江苏稳润光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for manufacturing white light LEDs, which realizes the uniform coating of phosphor powder, and does not require special custom-made wafers, and overcomes the problems of poor consistency and yellow circles caused by the existing white light LED production methods

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  • White light-emitting diode (LED) manufacturing method
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  • White light-emitting diode (LED) manufacturing method

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with drawings and embodiments.

[0022] Such as Figure 1 ~ Figure 3 Shown, the present invention comprises the following steps:

[0023] a. The ceramic substrate 1 covers the die-bonding area by electroplating metal silver or aluminum with high reflectivity, effectively increasing the reflectivity of light; and printing it into a circuit.

[0024] b. By pouring silver into the channels of the ceramic substrate 1 , connect the heat sink 2 of high thermal conductivity copper alloy at the bottom thereof.

[0025] c. Fix the chip 3 with a length and width of more than 30 mil (1 mil=1 / 1000 inch=0.0254mm) by using high thermal conductivity silver glue with a thermal conductivity of 15w / m.k or more, and use gold wire 4 to weld and connect the circuit.

[0026] d, a porous metal template 5 is placed on the ceramic substrate 1, and a chip 3 with a welded line is accommodated in each channel 51, such as figu...

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Abstract

The invention discloses a white LED manufacturing method, comprising the following steps: a. electrosilvering on a ceramic substrate (1) or covering a solid crystal region by aluminum, and printing a circuit; b. injecting silver to a pore path of the ceramic substrate (1), and connecting with a radiating heat sink (2); c. fixing a wafer (3) by utilizing silver paste, welding a connection circuit by utilizing a gold line 4; d. placing a porous metal template (5) on the ceramic substrate (1); e. injecting silica gel and phosphor in each pore path (51) of the metal template (5), and covering the wafer (3) and the gold line (4); f. baking silica gel; g. taking out the metal template (5) to form a plurality of fluorescent silica gel layers (6); h. covering the other metal template on the fluorescent silica gel layers (6); and injecting the silica gel into a hemispheric concave chamber of the metal template; and i. baking the silica gel into a silica gel lens (7), demouding and cutting. By the method provided by the invention, the problems that the consistency of the existing white LED is poor and a yellow ring exists are solved, the coating uniformity of the fluorescent powder is realized, and the special custom-made wafer is not needed.

Description

technical field [0001] The invention relates to a method for manufacturing an LED, in particular to a method for manufacturing a white light LED, and belongs to the technical field of lighting. Background technique [0002] At present, white light LEDs are generally produced by using PPA plastic, embedding a high thermal conductivity copper alloy heat sink, and coating phosphor powder on the blue light chip. When the phosphor powder is excited by blue light, it emits yellow light, and the blue light and yellow light mix to form white light. The coating method of phosphor powder is divided into dispensing method and printing method on the surface of the wafer. When the dispensing method is used, the manufacturing consistency is poor, and the problem of yellow circles is easy to occur; the printing method is complicated in process and must use a specially customized light-emitting chip. Only in this way can it be realized, and the production cost is high, which cannot be reali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/64
CPCH01L2224/48091
Inventor 胡建红董昀
Owner 中外合资江苏稳润光电有限公司