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3D Antenna Arrays and Structures

A technology of three-dimensional antenna and antenna structure, which is applied to the directions of antenna arrays, antennas, and electrical short antennas that are powered on separately, and can solve problems such as inability to implement

Active Publication Date: 2014-10-29
AVAGO TECH INT SALES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with these three-dimensional antennas is that they cannot be implemented in a substantially two-dimensional space in a substrate, such as an integrated circuit (IC) and / or a printed circuit board (PCB) that supports the IC

Method used

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  • 3D Antenna Arrays and Structures
  • 3D Antenna Arrays and Structures
  • 3D Antenna Arrays and Structures

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0094] figure 1 is a schematic diagram of a device 10 in one embodiment, including a device substrate 12 and a plurality of integrated circuits (ICs) 14-20. Each of the aforementioned ICs includes a substrate 22-28 and a die 30-36. Die 30 of IC 14 includes functional circuitry 54 and radio frequency (RF) transceiver 46 connected to antenna structure 38 on substrate 12 . Die 32 of IC 16 includes antenna structure 40 , RF transceiver 48 and functional circuitry 56 . Die 34 of IC 18 includes RF transceiver 50 and functional circuitry 58 , package substrate 26 and substrate 12 of IC 18 support antenna structure 42 to which RF transceiver 52 is connected. Die 36 of IC 20 includes RF transceiver 52 and functional circuitry 60 , and package substrate 28 of IC 20 supports antenna structure 44 to which RF transceiver 52 is connected.

[0095] Device 10 is any type of electronic device that includes an integrated circuit. For example, but far from being an exhaustive list, the devic...

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PUM

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Abstract

A three-dimensional antenna structure includes first (142) and second (144) antenna components and a via (146). The first antenna component is on a first layer of a substrate and the second antenna component is on a second layer of a substrate. The via couples the first antenna component to the second antenna component, wherein the first antenna overlaps, from a radial perspective, the second antenna component by an angle of overlap.

Description

technical field [0001] The present invention relates to wireless communication systems, and more particularly to an antenna for such a system. Background technique [0002] As is well known, a communication system supports wireless and wired communication between wireless and / or wired communication devices. These communication systems range from national mobile phones and / or international mobile phones to the Internet to peer-to-peer home wireless networks to radio frequency identification (RFID) systems. Each type of communication system is built and then operates according to one or more communication standards. For example, the standards that radio frequency (RF) wireless communication systems operate on include RFID, IEEE 802.11, Bluetooth, Advanced Mobile Phone System (AMPS), Digital AMPS, Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), WCDMA , local multipoint distribution system (LMDS), multiplex multipoint distribution system (M...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q21/06H01Q1/38
CPCH01Q1/2283H01Q1/36H01Q1/48H01Q1/38H01Q9/285
Inventor 尼古拉斯·G·亚历克索普洛斯刘运宏
Owner AVAGO TECH INT SALES PTE LTD