Low profile cavity backed integrated antenna with widened frequency band
A widening frequency band and integrated antenna technology, applied in the microwave field, can solve the problems of high processing cost, narrow working bandwidth, and limited antenna application, and achieve the effect of reducing production cost and volume
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0025] Such as figure 1 As shown, the low-profile cavity-backed integrated antenna with expanded frequency band includes a dielectric substrate 1 with a thickness of 0.5 mm. The dielectric substrate 1 has metal layers on both sides, which are metal layer 5 and metal layer 6, respectively. Through the dielectric substrate 1, the metal layer 5 and the metal layer 6 there is a through hole with a diameter of 1 mm, and the inner wall of the through hole is plated with metal to form an electrical interconnection unit 3. A plurality of electrical interconnection units 3 are arranged sequentially into an electrical interconnection array with rectangular outlines and rectangular sides of 17.8 mm and 12.3 mm, respectively. The electrical interconnection unit holes forming the electrical interconnection array have the same pitch, which is 1.5 mm. . The metal layer 5, the metal layer 6 and the area included in the electrical interconnection array form a rectangular cavity. Such as figur...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com