Low-loss oriented cutting method of large-size sapphire crystal blanks

Abstract

The invention provides a low-loss directional cutting method of large-size sapphire crystal blanks. The large sapphire crystal blanks are fed in a rotation manner in the method, and the processing efficiency of the method is improved by one time than that of a traditional band-saw cutting method. Before cutting, the end faces of the large-size sapphire crystal blanks are oriented, steel plates in corresponding angles are selected according to the crystal orientation deviation of the end faces for bonding, thereby the accurate orientation is finished in a cutting procedure. The method is greatly improved on the basis of the traditional band-saw cutting method, has the advantages of higher cutting efficiency, better cutting surface quality, high surface flatness, shorter follow-up processing time, lower unit production cost and the like, and can be used for correcting the crystal orientation of the end faces of the large sapphire crystal blanks.

Description

[0001] (1) Technical field [0002] The invention relates to a sapphire crystal cutting method, in particular to a low-loss directional cutting method for a large-sized sapphire crystal blank with a diameter greater than 100mm. (2) Background technology [0003] Sapphire single crystal has excellent optical properties, mechanical properties, chemical stability, high temperature performance and electrical properties, so it is widely used in many fields such as optoelectronic information, aerospace, national defense and semiconductor lighting. [0004] Due to the high hardness and high brittleness of the sapphire material, it is extremely difficult to machine it, especially for cutting large-sized sapphire blanks with a size greater than 100mm. [0005] At present, the cutting methods of large-size sapphire single crystal blanks include outer circle cutting method, inner circle cutting method, band saw cutting method, diamond wire cutting method, etc. The outer circle cutting ...

AI Technical Summary

Problems solved by technology

When processing large-sized sapphire crystal blanks with the above two cutting methods, the cut surface quality and flatness are relatively poor

Moreover, due to the high brittleness of the sapphire material, large chipping will occur when the saw blade is about to cut the crystal material

Therefore, although the thickness of the band saw blade is relatively thin, the actual loss of cutting large-sized sapphire crystal blanks is relatively large due to reasons such as poor flatness and large chipping of the sapphire crystal after cutting.