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Intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding

A fast-curing, lead-free soldering technology, used in adhesives, epoxy glue, adhesive types, etc.

Active Publication Date: 2013-04-24
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the patch adhesive can be quickly cured at medium temperature and have good bonding strength after curing, the present invention solves the performance that cannot be achieved by a single curing agent by using three latent curing agents for coordination.

Method used

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  • Intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding
  • Intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The composition and mass percentages of the medium-temperature fast-curing patch adhesive prepared in the examples that can be used in lead-free soldering are:

[0029] E51 type epoxy resin 30.0%

[0030] Bisphenol F type epoxy resin 830 30.0%

[0031] Compound curing agent 21.0%

[0032] Glycidyl tertiary carbonate 10.0%

[0033] Hydrogenated Castor Oil 3.5%

[0034] Fumed silica 7.0%

[0035] Talc 8.0%

[0036] Oil soluble red 0.5%

Embodiment 2

[0038] The composition and mass percentages of the medium-temperature fast-curing patch adhesive prepared in the examples that can be used in lead-free soldering are:

[0039] E51 type epoxy resin 50.0%

[0040] Compound curing agent 16.0%

[0041] Glycidyl tertiary carbonate 15.0%

[0042] Fumed silica 5.0%

[0043] Hydrogenated Castor Oil 3.5%

[0044] Talc 10.0%

[0045] Oil soluble red 0.5%

Embodiment 3

[0047] The composition and mass percentages of the medium-temperature fast-curing patch adhesive prepared in the examples that can be used in lead-free soldering are:

[0048] Bisphenol F type epoxy resin 830 50.0%

[0049] Compound curing agent 20.0%

[0050] Glycidyl tertiary carbonate 8.0%

[0051] Hydrogenated Castor Oil 3.0%

[0052] Fumed silica 5.0%

[0053] Talc 13.5%

[0054] Oil soluble red 0.5%

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Abstract

The invention discloses an intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding, belonging to the field of electronic industry. The adhesive comprises the following components in percentage by mass: 50.0-60.0% of low-viscosity epoxy resin, 14.0-22.0% of complex latent curing agent, 6.0-15.0% of active diluent, 0.0-6.0% of plasticizer, 5.0-10.5% of thixotropic agent, 7.5-13.5% of inorganic filling material and 0.5-1.0% of pigment. The adhesive can be used for the lead-free welding and can be rapidly cured at the intermediate temperate of 110 DEG C within 140-155 seconds; and after being cured, the adhesive has high stretching and shearing strength, is repairable, has favorable forming property, is less possible to spread and cave in, and can be applied to the technical field of lead-free electronic packaging.

Description

technical field [0001] The invention relates to a single-component epoxy adhesive for surface assembly, in particular to a patch adhesive used in the electronics industry that can be cured at medium temperature and quickly under lead-free soldering conditions, and belongs to the field of the electronics industry. Background technique [0002] SMD adhesive plays a vital role in the electronic assembly process. The quality of SMD adhesive directly affects the welding quality. With the rapid development of the electronics industry, surface assembly technology is moving towards high density, miniaturization, light weight, high Reliability and other directions are developed, so it is also called the first generation of SMT adhesives for the development of low temperature and fast curing for SMT adhesives. [0003] In order to protect the environment, the European Union has passed the Waste Electrical and Electronics Act (WEEE), clearly declaring that electrical and electronic pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J11/06
Inventor 雷永平兰海婷夏志东杨晓军尹兰礼史耀武郭福
Owner 深圳市唯特偶新材料股份有限公司