Manufacturing process of high withstand voltage ultrafine electromagnetic wire

Abstract

The invention discloses a manufacturing process of a high withstand voltage ultrafine electromagnetic wire, relates to the field of microelectronic material manufacturing, and in particular relates to the manufacturing process of the high withstand voltage ultrafine electromagnetic wire. The invention has the technical scheme that a material manufacturing process, a heating processing technology, gas protection and a mold technology are fused for the production process of the high withstand voltage ultrafine electromagnetic wire. The manufacturing process comprises the following steps: paying off the bare wire, softening annealing, painting, baking and winding up, and specifically as below: as the above design is adopted, compared with the prior art, on the basis of the national standard GB / T6109.4-1988, the pressure resistance level of the produced ultrafine electromagnetic wire is improved by 3-5 times, the minimum breakdown voltage can reach 700-760V, and manufactured ultrafine electromagnetic wire has the advantages of bright surface with no burrs, even thickness of the painted film, high voltage resistance, high energy efficiency and the like.

Description

technical field [0001] The invention relates to the field of production of microelectronic materials, in particular to a preparation process of high-voltage-resistant ultra-fine electromagnetic wires. Background technique [0002] Microelectronic materials are mainly used in the production of tiny and precise electronic components, such as relays, micro motors, electronic transformers, solenoid valves, etc., and are widely used in communication equipment, computers, automotive electronics, IC cards, office and electronic products , is the key basic raw material for the electronic information industry. [0003] Ultra-fine electromagnetic wire usually refers to the electromagnetic wire with a wire diameter below φ0.08mm, which is widely used in high-precision electrical equipment, such as hollow coils, watch coils, IC card coils, and buzzers, vibration motors, high-precision Electronic coils such as speakers. At present, the demand for ultra-fine electromagnetic wires in the...

AI Technical Summary

Problems solved by technology

[0004] At present, the ultra-fine microelectronics production process has the following shortcomings: 1. The surface of the ultra-fine bare wire has not been cleaned before painting

If the surface of the ultra-fine bare wire is not clean, there will be copper particles produced during wire drawing on the surface, and the surface of the painted ultra-fine electromagnetic wire will not be smooth, and the paint will be uneven, resulting in many pinholes in the ultra-fine electromagnetic wire. lead to low pressure

2. During the softening annealing process, if the ultra-fine bare wire is oxidized, the adhesion of the paint coated on the oxide layer is poor, which affects the pressure resistance effect of the ultra-fine electromagnetic wire

Because of its high viscosity, the resistance of the ultra-fine bare wire is also large when it is painted, so the paint film of the coated ultra-fine electromagnetic wire is not very uniform, and it is easy to break the wire. The produced ultra-fine electromagnetic wire cannot reach high withstand voltage. requirements