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Method for chemically synthesizing nano lead-free solder particles with low melting point

A technology of lead-free solder alloy and lead-free solder, which is applied in the field of chemical synthesis of low-melting point nano-lead-free solder particles, can solve the problems of no similar patents, and achieve the effect of low cost and simple process

Inactive Publication Date: 2011-09-21
SHANGHAI UNIV
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  • Application Information

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Problems solved by technology

[0010] The applicant of the present invention used lead-free solder+nanoparticle+chemical reduction (lead-free solder+nanoparticle+chemical reduction) as keywords to search the United States Patent Abstracts (USPTO), European Patent Abstracts (EP-PCT), "Chinese Patent Information Network" and "Patent Search of the State Intellectual Property Office of the People's Republic of China", no similar patents were found

Method used

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  • Method for chemically synthesizing nano lead-free solder particles with low melting point
  • Method for chemically synthesizing nano lead-free solder particles with low melting point
  • Method for chemically synthesizing nano lead-free solder particles with low melting point

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Embodiment 1

[0038] This embodiment selects the lead-free solder alloy of Sn3.5Ag, and the specific process steps are as follows:

[0039] a. Weigh 0.2998g of stannous octoate, 0.0051g of silver nitrate (the weight ratio of Sn and Ag is 96.5 / 3.5) and 0.2775g of phenanthroline and add it to 50ml of absolute ethanol, and use a magnetic stirrer to stir in the atmosphere Stir vigorously for 2 hours under ambient conditions to obtain a uniformly mixed precursor solution;

[0040] b. Dissolve 0.1892g of sodium borohydride into 50ml of absolute ethanol solution, and form a uniform solution after vigorous stirring;

[0041] c. Prepare 6 parts of the precursor solution in step a, drop the reducing agent solution into 6 parts of the precursor solution, the titration time is 0 min, 11 min, 20 min, 27 min, 38 min and 58 min, and the rate of addition is controlled to Control the size and degree of agglomeration of nanoparticles;

[0042] d. Use a centrifuge to precipitate the Sn3.5Ag nanoparticles ob...

Embodiment 2

[0046] This embodiment selects the lead-free solder alloy of Sn3.0Ag0.5Cu. The specific process steps are basically the same as in Embodiment 1. The difference is that copper acetate is added to the reactant, and the weight ratio of Sn / Ag / Cu in the precursor solution for 96.5 / 3.0 / 0.5.

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Abstract

The invention provides a chemosynthesis method by which the sizes and shapes of nano lead-free solder particles can be controlled. The method is characterized in that nano particles with different sizes, shapes and aggregation degrees can be prepared by controlling the speed of dripping of a reducing agent solution in a precursor and controlling the concentration of a surfactant. According to the invention, the optimal synthesis parameters can be determined through experiments, and nano particles with required sizes can be obtained. The chemosynthesis method has the advantages of simple process, low cost and obvious effect of regulating and controlling the sizes and shapes of the nano lead-free solder particles, and can provide a reference for the application of a nano lead-free solder particle preparation technology based on a liquid-phase reduction method in industrial production.

Description

technical field [0001] The invention relates to a chemical synthesis method of low-melting-point nano-lead-free solder particles, which belongs to the field of nano-material preparation technology. Background technique [0002] For a long period of time in the past, Sn-Pb solder was the most important interconnection material in electronic packaging. The main advantages of Sn-Pb alloy are as follows: 1) Sn-Pb alloy is easy to process, low in price, and abundant in reserves; 2) Sn-Pb alloy has a lower melting temperature. The most widely used in Sn-Pb alloy is the eutectic composition, that is, Sn=62.7wt.%, Pb=37.3wt.%, which is the so-called Sn-37Pb eutectic solder, and the melting temperature is 183°C; 3) Sn- Pb solder has high reliability and good working performance; 4) Sn-Pb solder has good ductility and good wettability to Cu, Ag and their alloys. However, with people's deeper understanding of the toxicity of Pb and its environmental pollution, it has become a global ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24C22C1/00C22C13/00B23K35/26
Inventor 高玉来张卫鹏邹长东翟启杰
Owner SHANGHAI UNIV
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