Preparation method of codoped silicon-base impurity intermediate belt material
An intermediate band, co-doping technology, applied in diffusion/doping, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc., can solve the problem of high cost of laser annealing technology, achieve low preparation cost and increase open circuit current. Effect
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[0024] see figure 1 As shown, the present invention provides a kind of preparation method of co-doped silicon-based impurity intermediate band material, comprising the steps of:
[0025] Step 1: Take a silicon wafer, and the silicon wafer is only required to meet the specifications of silicon wafers used in ordinary experiments. There are no special requirements for silicon wafer thickness, resistivity, crystal orientation and other related parameters. The silicon wafers are acid cleaned to remove heavy ions and other impurity elements from the surface.
[0026] Step 2: Using ion implantation, implant Al into the silicon wafer with an implant dose of 2×10 15 cm -2 , the implanted energy is 30ev, so that the concentration of Al in the silicon wafer reaches 3.4×10 20 cm -3 .
[0027] Step 3: Implant a transition metal element into the Al-containing silicon wafer. The transition metal element can be Ti or Cr. Taking Ti doping as an example, ion implantation is adopted. The ...
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[0032] combined reference figure 1 , the invention provides a method for preparing a co-doped silicon-based impurity intermediate band material, comprising the steps of:
[0033] Step 1: Use a (100) n-type silicon wafer, boil the silicon wafer with concentrated sulfuric acid for 5 minutes, and then rinse it with hydrofluoric acid for 30 seconds.
[0034] Step 2: Implant Al into the silicon wafer with an implant dose of 2×10 15 cm -2 , the injected energy is 30eV.
[0035] Step 3: Implant Ti ions into the Al-containing silicon wafer, the implantation energy is 45ev, and the implantation dose is 1.7×10 15 cm -2 .
[0036] Step 4: annealing the silicon wafer containing Al and Ti ions at a temperature of 850° C. and an annealing time of 15 s.
[0037] Finally, a co-doped silicon-based impurity intermediate band material is formed in the surface layer of silicon.
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