Alkaline chloride copper-plating treatment agent and preparation method thereof

Abstract

The invention relates to the technical fields of electroplating additives and coating, in particular to an alkaline chloride copper-plating treatment agent and a preparation method thereof. The copper-plating treatment agent is characterized by comprising the following components in percentage by weight: 5-7 percent of sodium hydroxide, 5-7 percent of potassium chloride or sodium chloride, 1.5-3.5 percent of copper sulfate, 0.35-0.45 percent of 1.4 butynediol, 3.5-7 percent of potassium sodium tartrate and 76-84 percent of water. The alkaline chloride copper-plating treatment agent provided by the invention has the characteristics of high plating layer binding ratio and high sedimentation speed; an electroplated product is half bright and fine, has no brittleness, no peeling phenomenon at the baking temperature of 250 DEG C, no color change and high impurity resistance; the plating layer scarcely undergoes phenomena of misting and foaming separation; and the alkaline chloride copper-plating treatment agent provided by the invention has the advantages of low cost, water-saving performance and easiness for treatment of waste water.

Description

technical field [0001] The invention relates to the technical field of electroplating additives and finishing, in particular to an alkaline chloride copper plating treatment agent and a preparation method thereof. Background technique [0002] Copper plating electrolyte can be divided into two categories: cyanide copper plating and cyanide-free copper plating. Cyanide copper plating can be divided into three types of electroplating solutions: high cyanide, medium cyanide and low cyanide. Cyanide copper plating has the characteristics of high cathodic polarization, strong bonding ability between the coating and the steel substrate, good dispersion and coverage of the plating solution, fine crystallization of the coating, high stability of the electrolyte, high tolerance to impurities, and low corrosion to electroplating equipment. . Therefore, in the electroplating process, cyanide copper plating has long been dominant in the field of copper plating. Although cyanide coppe...

AI Technical Summary

Problems solved by technology

Disadvantages of sulphate copper plating are: poor dispersibility, non-uniform coating thickness on parts with complex geometries, or no coating deposition in deep recesses

[0004] Pyrophosphate copper plating solution can also be used for copper plating. The disadvantages are: high concentration of plating solution, high cost, large initial investment, strict pretreatment before the workpiece enters the tank, and basically no direct copper plating on steel. , but it needs to be pre-plated or dipped in propylene thiourea before copper plating in the tank

The fatal disadvantage of pyrophosphate copper plating is that potassium pyrosulfate will be hydrolyzed into orthophosphate. With the increase of orthophosphate, the current density decreases and the deposition rate decreases.