White light LED (Light Emitting Diode) device and manufacturing method thereof

A LED device and LED chip technology, applied in the field of lighting, can solve the problems of high cost, uneven glue distribution, poor stability, etc., and achieve the effect of convenient manufacturing process, simple structure, and adjustable color temperature

Inactive Publication Date: 2011-10-19
OCEANS KING LIGHTING SCI&TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the red, green and blue multi-chip technology is affected by the performance of a single chip, the output light is unstable and the stability is poor, and the cost is high
The blue LED chip plus yellow phosphor technology is currently the most widely used packaging method. The white LED obtained by this method has good color stability and simple process, but it is difficult to obtain white light with high color rendering due to the lack of red light. , at the same time, due to the need to mix the phosphor powder and glue to form a mixture during the packaging process, the phosphor powder in the mixture is prone to precipitation, which will lead to uneven glue distribution, resulting in poor light uniformity of the product and difficult to guarantee color tone consistency
Violet LED plus red, green and blue three-color phosphors to produce white light is limited by the phosphor, and the purple LED chips are expensive
In addition, due to the poor stability of organic dyes, the combination of a single LED chip and organic dyes to produce white light has not been well applied.

Method used

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  • White light LED (Light Emitting Diode) device and manufacturing method thereof
  • White light LED (Light Emitting Diode) device and manufacturing method thereof
  • White light LED (Light Emitting Diode) device and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Embodiment 1: as figure 1 , a white LED device, comprising a substrate 11, the substrate is an aluminum substrate, the substrate 11 is concave, cylindrical, a blue LED chip 12 is fixed on the inner bottom surface of the concave substrate 11, the inner bottom surface of the substrate 11 and its inner side Reflective treatment is done on the wall to reflect light and increase light utilization efficiency, for example, a reflective film is provided on the surface of the substrate 11 . A quantum dot composite luminescent material plate 14 is arranged above the blue LED chip 12 , and a transparent packaging material 13 is filled between the blue LED chip 12 and the quantum dot composite luminescent material plate 14 . The quantum dot composite luminescent material plate 14 is nano-microporous glass uniformly dispersed with luminescent quantum dots, and the nano-microporous glass is wrapped with light-transmitting epoxy resin, and the entire outer surface of the nano-micropor...

Embodiment 2

[0037] Embodiment 2: as figure 2 A single blue LED chip 22 is fixed on the concave bottom surface of the aluminum substrate 21, a quantum dot composite luminescent material plate 24 is arranged above the blue LED chip 22, and transparent Encapsulation material 23. The quantum dot composite luminescent material plate 24 is nano-microporous glass uniformly dispersed with yellow-light and red-light luminescent quantum dots, and the nano-microporous glass is protected by light-transmitting silica gel. The particle size of the luminescent quantum dots in this embodiment is 3-5 nm. The quantum dot composite luminescent material plate 24 in this embodiment is a curved plate, specifically a hemispherical shape with a convex surface outward.

[0038] The manufacturing steps of the white light LED device are as follows: first, a single blue LED chip 22 is fixed on the concave bottom surface of the aluminum substrate 11, after the blue LED chip 22 is welded with gold wires, a transpar...

Embodiment 3

[0039] Embodiment 3: as image 3A single violet LED chip 32 is fixed on the concave bottom surface of the aluminum substrate 31, a quantum dot composite luminescent material plate 34 is arranged above the violet LED chip 32, and a transparent layer is filled between the violet LED chip 32 and the quantum dot composite luminescent material plate 34 Encapsulation material33. The quantum dot composite luminescent material plate 34 is nano-microporous glass uniformly dispersed with luminescent quantum dots emitting blue light, green light, and red light, and the nano-microporous glass is wrapped with light-transmitting polymethyl methacrylate Protect. The particle size of the luminescent quantum dots in this embodiment is 5-8 nm. The quantum dot composite luminescent material plate 34 in this embodiment is a curved plate, specifically a convex arc plate with equal wall thickness. The curved panel is preferred, so that the light emitted from the white LED device is more concentr...

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PUM

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Abstract

The invention discloses a white light LED (Light Emitting Diode) device and a manufacturing method thereof, wherein the device comprises a base plate and at least one LED chip fixed on the base plate; a quantum dot composite light emitting material plate is arranged above the LED chip; and a transparent encapsulating material is filled between the LED chip and the quantum dot composite light emitting material plate. The manufacturing method comprises the following steps of: firstly fixing the LED chip on the base plate and welding a golden wire; then encapsulating the LED chip by filling the transparent encapsulating material; placing the quantum dot composite light emitting material plate above the encapsulating material and fixing the plate on the base plate; and finally, heating, curing and cooling the plate naturally to obtain the white light LED device. The invention provides the white light LED device with an optimized structure, high brightness, high lighting effect and high color rendering index by using the advantage that light emitted by quantum dots is continuous and adjustable in a visible light range; the manufacturing method and technology are convenient; and the manufactured LED device is simple in structure and stable in performance.

Description

technical field [0001] The invention belongs to the technical field of lighting, and relates to an LED device and a manufacturing method thereof, in particular to a white light LED device and a manufacturing method thereof. Background technique [0002] White light LED is a new generation of green and environment-friendly light source. Due to its advantages of long life, low energy consumption and fast start-up, white light LED has been widely used in signal lights, car lights, large-screen display and lighting and other fields. At present, there are mainly the following ways to obtain white light LED: white light technology composed of red, green and blue three-color chips, blue LED chip plus yellow phosphor powder, purple light LED plus red, green and blue three-color phosphor powder, and combination of LED single chip and organic light-emitting dye into white light. Among them, the red, green and blue multi-chip technology is affected by the performance of a single chip,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L2224/48091H01L2924/00014
Inventor 周明杰乔延波马文波
Owner OCEANS KING LIGHTING SCI&TECH CO LTD
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