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Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same

A technology of epoxy resin and prepreg, applied in the direction of metal layered products, synthetic resin layered products, layered products, etc., can solve the problems of low glass transition temperature, low toughness of copper clad laminates, unsuitable for printed circuit boards, etc. , to achieve excellent toughness, high processing efficiency, and improve the reliability of through holes

Inactive Publication Date: 2012-10-24
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the glass transition temperature of the one-component composition system disclosed in this patent is lower than 100 degrees, which is not suitable for printed circuit boards
[0008] In view of the above problems, it is necessary to study and improve the epoxy resin mixing system, so as to avoid the problem of low toughness applied to copper clad laminates and have better comprehensive performance

Method used

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  • Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same
  • Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Use EPON828 bisphenol A epoxy resin 70 parts, polybutadiene epoxy resin 3 parts, E100 aromatic amine 20 parts, polybutadiene maleic anhydride 7 parts, silicon micropowder 15 parts, flame retardant brominated styrene 20 parts Parts and supplemented with catalyst 2-PI, use MEK to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use 7628 type electronic grade glass cloth to soak the glue, and bake in an oven at 155°C to remove the solvent to obtain a B-stage prepreg.

[0048] Laminate eight prepregs and two one-ounce electrolytic copper foils together, and laminate them with a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190°C, and keep this temperature for 90 minutes. The corresponding performance is shown in Table 1 and Table 2. ...

Embodiment 2

[0063] Use 10 parts of DER593 epoxy resin, 65 parts of DER560 brominated epoxy resin, 4 parts of polybutadiene epoxy resin, 5 parts of polybutadiene maleic anhydride, 16 parts of E100 aromatic amine, 10 parts of HF-1 cyanate parts, 20 parts of silicon micropowder, supplemented with catalyst zinc octoate and 2-PI, use MEK to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use 7628 type electronic grade glass cloth to soak the glue, and bake in an oven at 155°C to remove the solvent to obtain a B-stage prepreg.

[0064] Laminate eight prepregs and two one-ounce electrolytic copper foils together, and laminate them with a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190 degrees, and keep this temperature for 90 minutes. The corresponding ...

Embodiment 3

[0066] Use 35 parts of DER593 epoxy resin, 35 parts of DER560 brominated epoxy resin, 4 parts of polybutadiene epoxy resin, 10 parts of methyl hexahydrophthalic anhydride, 16 parts of E100 aromatic amine, 20 parts of silicon micropowder, With the aid of catalyst 2-PI, MEK is used to dissolve the above compounds and prepare a glue with a suitable viscosity. Use 7628 type electronic grade glass cloth to soak the glue, and bake in an oven at 155°C to remove the solvent to obtain a B-stage prepreg.

[0067] Laminate eight prepregs and two one-ounce electrolytic copper foils together, and laminate them with a hot press to obtain a double-sided copper-clad laminate. Lamination conditions were the same as in Example 2. The corresponding properties are shown in Table 3.

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Abstract

The invention relates to an epoxy resin composition as well as a prepreg and a metal-foil-clad laminated board manufactured by using the same. The epoxy resin composition comprises the following components: epoxy resins, which are bisphenol A epoxy resins or isocyanate-modified epoxy resins or a mixture thereof; polybutadiene resins of which the epoxy equivalent is 200-1000 and the number averagemolecular weight is 500-5000; a curing agent, which is a mixed curing agent of amine and anhydride curing agents; and silicon micropowder. The prepreg using the epoxy resin composition includes a base material and the epoxy resin composition attached to the base material by impregnating and drying. The metal-foil-clad laminated board manufactured by using the epoxy resin composition includes a plurality of laminated prepregs and metal foils formed on one or two surfaces of the laminated prepregs. The epoxy resin composition provided by the invention has the advantages of heat resistance, dip soldering resistance, moisture resistance, moisture heat resistance, good toughness and high processing efficiency, and is adaptable to the lead-free printing performance requirements on the laminatedboard.

Description

technical field [0001] The present invention relates to an epoxy resin composition, in particular to an epoxy resin composition with heat resistance, dip soldering resistance, moisture resistance, heat and humidity resistance and excellent toughness, and a prepreg and a metal foil-clad layer made thereof platen. Background technique [0002] With the rapid development of electronic and electrical products in the world, the environmental hazards of electronic and electrical product waste and toxic substances in electronic and electrical products are becoming more and more serious. Facing pressure to protect the environment, the industry has switched from using lead-containing solders to lead-free solders. The temperature of lead-free solder is 20-30 degrees higher than that of leaded solder. For some harsh process conditions, the temperature of lead-free solder has reached 260 degrees or even 270 degrees. This directly leads to more stringent reliability tests for circuit s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/08C08G59/58C08K3/02B32B15/092B32B27/04H05K1/03
Inventor 陈勇苏民社苏晓声
Owner GUANGDONG SHENGYI SCI TECH
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