Low-temperature cured conductive silver paste and preparation method and use thereof

A technology of conductive silver paste and low temperature, which is applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, conductive material dispersed in non-conductive inorganic materials, etc., which can solve the problems of prolonged baking time, large energy consumption, and Long time and other issues, to achieve excellent bending resistance, less silver consumption, cost-saving effect

Active Publication Date: 2012-06-06
KUNSHAN JOING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008]The current conductive pastes on the market need relatively high baking temperature and prolonged baking time to enhance the bending resistance of the product, which consumes a lot of energy and makes the It takes a long time; in addition, in order to achieve the required conductivity, a large amount of silver powder (60% to 80%) needs to be added, and the cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] According to this embodiment, the low-temperature curing conductive silver paste raw material formula consists of: silver powder 450g, A10 260g,

[0036] A40 280g, B75 9g; white carbon black 1g.

[0037] The production process of conductive silver paste is: batching→stirring→grinding→testing→qualified products, the details are as follows: Weigh various raw materials in proportion (weigh the organic carrier first, and then weigh the solid powder), and use the mixer at a slow speed Stir to make the solid powder completely mixed into the liquid phase, increase the speed of the mixer, and stir for 20 minutes, then transfer the stirred semi-finished slurry to a three-roll mill for grinding, and repeat the grinding for 4 times until the silver paste is finely ground by a scraper. The micrometer test is less than 7μm. The ground silver paste is bottled and packaged, and the unqualified silver paste is adjusted to qualified bottled package according to the detection inde...

Embodiment 2

[0053] According to this embodiment, the low-temperature curing conductive silver paste raw material formula is composed of: silver powder 22.5kg, A15 13.25 kg, A40 13.25kg, B75 0.99kg; white carbon black 0.01kg.

[0054] The raw materials in the above ratio were produced by the same production process as in Example 1 to obtain conductive silver paste, and its various properties were measured to meet the requirements of conductive silver paste for large keyboards, and the curing temperature was 115°C.

Embodiment 3

[0056] According to this embodiment, the low-temperature curing conductive silver paste raw material formula consists of: silver powder 450g, A15 265g, A40 265g, B75 19g; white carbon black 1g.

[0057] The raw materials in the above ratio were produced by the same production process as in Example 1 to obtain conductive silver paste, and its various properties were measured to meet the requirements of conductive silver paste for large keyboards, and the curing temperature was 115°C.

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PUM

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Abstract

The invention relates to low-temperature cured conductive silver paste and a preparation method and use thereof. The conductive silver paste is composed of the following components in percentage by weight: 40-45% of silver powder, 9-12% of polymer resin carrier, 42-48% of dimethyl nylon acid, 0.8-2% of water-soluble polyurethane curing agent, and 0.01-0.2% of white carbon black, wherein the average grain diameter of the silver powder is 5.5-10 mu m; the specific surface area is 1.9-2.20 m<2> / g; the silver purity is more than or equal to 99.5 wt%; and the polymer resin carrier is composed of polyethylene glycol terephthalate and chloric vinegar resin in a mass ratio of 1:(1-1.2) or composed of polyurethane resin and chloric vinegar resin in a mass ratio of 1:(1-1.2). Compared with the original like products, the conductive silver paste in the invention has the advantages of low curing temperature, low production cost and the like.

Description

technical field [0001] The invention relates to a low-temperature curing conductive silver paste, its preparation method and application. Background technique [0002] It is known that the conductive silver paste used in notebook computer photoelectric touch modules and other related products is required to have the following characteristics: [0003] ① Bending resistance: Since the connecting part of the touch module needs to be bent during the assembly process of the notebook computer to flexibly design the placement of software such as the computer motherboard, there are high requirements for the bending resistance of the touch module . [0004] ② Conductivity; [0005] ③Printability: Silver paste is required to be suitable for screen printing to reduce circuit defects, open circuit and short circuit. [0006] ④Low-halogen: Only low-halogen or halogen-free silver paste products can meet environmental protection requirements. [0007] ⑤ Stability: The silver paste is r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B5/14H01B13/00
Inventor 兰玉彬
Owner KUNSHAN JOING TECH
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