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Silicon micro gyroscope with triangular vibrator and manufacturing method thereof

A technology of silicon microgyroscope and manufacturing method, which is applied in the direction of steering induction equipment, etc., can solve the problems of difficult processing of capacitance gap, difficult control of side wall surface roughness precision, easy to cause tunneling, etc., and achieves simple structure, high yield, The effect of simple production process

Inactive Publication Date: 2011-12-14
SHANGHAI JIAO TONG UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This technology has the following disadvantages: the capacitive gap between the ring electrode of the capacitive bulk acoustic wave gyroscope and the disk-shaped vibrator is only 200nm, and the thickness of the disk is 40μm. The width ratio is as high as 200:1, and it is difficult to process the capacitor gap, and because of the small gap, it is difficult to control the surface roughness accuracy of the side wall, and it is easy to cause tunneling during the working process

Method used

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  • Silicon micro gyroscope with triangular vibrator and manufacturing method thereof
  • Silicon micro gyroscope with triangular vibrator and manufacturing method thereof
  • Silicon micro gyroscope with triangular vibrator and manufacturing method thereof

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Embodiment 1

[0035] like figure 1 , figure 2 , image 3 As shown, this embodiment includes an equilateral triangular vibrator 1 with three vibrating beams, a driving electrode 2 parallel to the vibrating beams with a certain gap, a detection electrode 3 parallel to the vibrating beams with a certain gap, and a substrate 4 .

[0036] In this embodiment, the triangular vibrator 1 is composed of three vibration beams 5 connected end to end, three spoke-shaped support beams 6 and a cylindrical support column 7 .

[0037] In this embodiment, there are three driving electrodes 2, which are respectively parallel to the three vibrating beams 5 of the equilateral triangular vibrator 1, and have a certain gap, and are located at the midpoint of the vibrating beams 5. form a capacitor.

[0038] In this embodiment, there are three pairs of detecting electrodes 3 , which are respectively located on both sides of the driving electrode 2 and parallel to the driving beam 5 , and each pair of detecting...

Embodiment 2

[0045] This embodiment relates to the manufacturing process of the microgyroscope described in Embodiment 1, such as Figure 6-Figure 9 As shown, it mainly includes the following steps:

[0046] (a) Clean the silicon wafer, dry it, and then sputter a layer of metal aluminum with a thickness of several microns on the single side of the silicon wafer.

[0047] (b) Using aluminum as a mask, spin-coat a layer of photoresist on the aluminum surface, use the prepared mask to photoresist, develop, then pattern the aluminum mask, and finally use deep reactive ion etching The structure of the driving electrode 2, the detecting electrode 3 and the cylindrical supporting column 7 is deeply etched.

[0048] (c) Remove the aluminum mask in the previous step, clean and dry the silicon wafer, oxidize the cavity etched by the silicon wafer in the previous step, and make a protective layer of silicon oxide to protect the prepared supporting pillars 7 .

[0049] (d) The silicon wafer and ...

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Abstract

The invention relates to a silicon micro-gyroscope with a triangular oscillator and a manufacturing method thereof of the micro-electromechanical technical field, and the silicon micro-gyroscope comprises an equilateral triangle oscillator with three vibrating beams, driving electrodes which are parallel to the vibrating beams and have a certain interval, detection electrodes which are located at two sides of the driving electrode and are parallel to the vibrating beams, and a substrate. The manufacturing method of the micro-gyroscope adopts a bulk silicon micro-processing process, has a simple manufacturing process, high reliability, and can ensure low cost and high yield. The micro-gyroscope of the invention has a small volume, a simple structure, an easily-realized processing process, compatibility with CMOS technology, impact resistance, does no require vacuum packaging, and is applicable to batch production.

Description

technical field [0001] The invention relates to a micro-gyroscope in the field of micro-electromechanical technology and a manufacturing method thereof, in particular to a silicon micro-gyroscope with a triangular vibrator and a manufacturing method thereof. Background technique [0002] Gyroscope is an inertial device that can be sensitive to the angle or angular velocity of the carrier, and it plays a very important role in the fields of attitude control, navigation and positioning. With the development of national defense technology and aviation and aerospace industries, the requirements of inertial navigation systems for gyroscopes are also developing in the direction of low cost, small size, high precision, high reliability, and adaptability to various harsh environments. [0003] After searching the literature of the prior art, it is found that the Chinese patent "capacitive bulk acoustic wave gyroscope" (patent application number: 200680054450.2) utilizes (100) silico...

Claims

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Application Information

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IPC IPC(8): G01C19/56
Inventor 张卫平关冉陈文元张弓崔峰吴校生刘武
Owner SHANGHAI JIAO TONG UNIV
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