Cytosis polymer microfluidic chip and preparation method thereof

Abstract

A membrane mobile polymer microfluidic chip and a preparation method of the same. The microfluidic chip comprises: a first substrate (100), a membrane (300), several structure parts (101) located on one surface of the first substrate (100), several first through holes (102) located on the first substrate (100), and a second substrate (200). One surface of the second substrate (200) is attached to the other surface of the first substrate (100), and the other surface of the second substrate (200) is smooth. The second substrate (200) is provided with a second through hole (201) corresponding to the first through hole (102) of the first substrate (100). The first through hole (102) and the second through hole (201) form an integral through hole (400). The membrane (300) is attached to the other surface of the second substrate (200). The preparation method comprises the following steps: disposing at least one fuse wire (103, 202) on welding surfaces of a first substrate (100) and a second substrate (200); and attaching the first substrate (100) to the second substrate (200) and fusing the fuse wire (103, 202) to welding the first substrate (100) to the second substrate (200), and after welding, attaching a membrane (300) to a surface of the second substrate (200).

Description

Technical field [0001] The invention relates to the technical field of manufacturing a membrane-moving polymer microfluidic chip, in particular to a membrane-moving polymer microfluidic chip and a preparation method thereof. Background technique [0002] Microfluidics is the use of technology to manipulate micro-volume fluids, applied to the structure and control methods of biological and chemical fluid systems. The applications and potential applications of microfluidics include disease diagnosis, life science research, and biological and / or chemical sensor development. [0003] The membrane-moving polymer microfluidic structure includes a substrate, which has one or more microfluidic channels or paths, and a cover plate or a second or more sub-substrate, which has fluid paths that may or may not be interconnected. These microfluidic structures can be collectively referred to as microfluidic chips. [0004] Microfluidic chips can be made of glass, quartz or silicon. These chips ty...

AI Technical Summary

Problems solved by technology

For structures that contain containers in the substrate that will cause uneven distribution of the substrate’s plane material, the uneven material structure during injection molding will cause uneven stress, which will cause shrinkage pits on the plane corresponding to the substrate structure and damage the flatness of the substrate surface.

The bonding between the diaphragm and the substrate requires the bonding surface of the substrate to be very flat, and the uneven surface will cause defects or bubbles in the bonding area, destroying the microstructure function, resulting in unqualified products, and directly affecting the pass rate of bonding.

The unevenness of the injection molded substrate can be solved by subsequent flatness treatment, but the effect of the subsequent treatment will not be very good. In addition, the cost of the subsequent treatment will increase the production cost of the product and reduce the production efficiency.

[0009] Membrane polymer microfluidic chips sometimes need to include more than two substrates depending on the application, and the substrates can be welded by fusible wires (conducting wires). Method", this patent provides a working method for welding plates with conductive wires; but it does not solve the welding method of the conductive connection of the two plates, and how to ensure the flatness of the bonding surface between the substrate and the diaphragm

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