Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip

A technology of microfluidic chip and welding method, which is applied in the direction of welding equipment, laser welding equipment, chemical instruments and methods, etc.

Active Publication Date: 2015-04-22
BEIJING BOHUI INNOVATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is: how to realize the firm welding between the substrate and the diaphragm of the membrane-moving polymer microfluidic chip, and the welding surface is flat and uniform

Method used

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  • Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip
  • Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip
  • Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip

Examples

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Effect test

Embodiment 1

[0045] This embodiment provides a method for welding a substrate and a diaphragm of a membrane-moving polymer microfluidic chip, such as figure 1 As shown, it is a schematic diagram of a welding structure using the welding method in this embodiment. Before welding, the substrate 100 is fixed, the diaphragm 200 covers the surface of the substrate 100, and pressure is applied to press the diaphragm 200 on the surface of the substrate 100. In this embodiment, a transparent pressing plate 300 is used to apply pressure to the diaphragm.

[0046]Preferably, in order to make the welding firm, a tensioning device 600 is used to apply a certain tension to the diaphragm 200 , and the tensioned diaphragm 200 is covered on the surface of the substrate 100 . When applying pressure, the tensile force is adjusted according to the elastic parameters of the diaphragm 200 and the applied pressure. Since the diaphragm 200 is stretched, the substrate 100 bears against the diaphragm 200 from below...

Embodiment 2

[0051] This embodiment provides a method for welding a substrate and a diaphragm of a membrane-moving polymer microfluidic chip, such as figure 2 As shown, it is a schematic diagram of a welding structure using the welding method in this embodiment. The welding procedure is basically the same as that in Embodiment 1, the difference is the way of applying pressure to the diaphragm 100 . In this embodiment, pressure is applied to the diaphragm 100 by means of air pressure-pressing the membrane. Before welding, the substrate 100 is fixed, and the membrane 200 covers the surface of the substrate 100 . Preferably, the membrane 200 is stretched and covered on the surface of the substrate 100 by using the tensioning device 600 . The pressure chamber 800 and the pressure film 900 are placed on the surface of the diaphragm 200. The pressure film 900 seals the pressure chamber 800 in advance. The pressure sensor 801 and the control valve 802 are arranged on the body of the pressure c...

Embodiment 3

[0058] like image 3 As shown, the substrate and diaphragm welding method of the membrane-moving polymer microfluidic chip provided in this embodiment is basically the same as that of Embodiment 2, the difference is that the pressure film is not used to seal the air pressure chamber 800, but the substrate 100 and the diaphragm are placed After 200, the diaphragm 200 is compressed around the air pressure chamber 800 through the sealing seat 803 matched with the air pressure chamber 800, so as to seal the air pressure chamber 800. Preferably, the tensioning device 600 is used to apply tension to the membrane 200 to make it taut before sealing. The pressure application method is the same as that of Example 2.

[0059] Preferably, during inflation, the tensile force is adjusted according to the elastic parameters of the diaphragm 200 and the air pressure, so as to control the tensile deformation and ensure the welding quality. In this embodiment, since the diaphragm 200 is used ...

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Abstract

The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform.

Description

technical field [0001] The invention relates to the technical field of membrane dynamic polymer microfluidic chip manufacturing, in particular to a method for welding a substrate and a diaphragm of a membrane dynamic polymer microfluidic chip. Background technique [0002] The manufacturing method and device of the membrane-moving polymer microfluidic chip are the key to realizing the industrialized production of microfluidic technology and entering the application market. Using the laser radiation fusion welding method to weld the polymer can improve the welding accuracy and quality, and can carry out micro welding. processing. [0003] The Chinese invention patent "laser welding method and device for welding plastic workpieces or plastics and other materials ZL00101924.4" discloses a method for welding plastic workpieces by laser, which is to press two workpieces to be welded together, and the welding surfaces are in contact with each other. , the workpiece close to the l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/21B23K26/70B29C65/16
CPCB01L2300/0816B29C66/82661B29C66/82423B29C65/1635B01L2300/044B29C66/961B29C66/244B29C66/934B29C65/16B01L3/502707B29C66/9241B81B2201/058B29C66/8322B81B2203/0127B01L2200/0689B29C66/344B29C66/242B81C2203/036B29C66/81267B29C66/53461B29C66/919B29C66/939B29C66/9221B29C66/81455B29C65/1654B29C66/8266B29C66/9161B29L2031/756B29C65/1696B29C66/82421B81C3/001B29C66/1122B29C66/7392
Inventor 杨奇
Owner BEIJING BOHUI INNOVATION TECH
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